Global Patent Index - EP 1481423 A2

EP 1481423 A2 20041201 - ELECTRONIC MODULE, PANEL WITH INDIVIDUAL ELECTRONIC MODULES AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

ELECTRONIC MODULE, PANEL WITH INDIVIDUAL ELECTRONIC MODULES AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

ELEKTRONISCHES MODUL, NUTZEN MIT ZU VEREINZELNDEN ELEKTRONISCHEN MODULEN UND VERFAHREN ZU DEREN HERSTELLUNG

Title (fr)

MODULE ELECTRONIQUE, TABLEAU MUNI DE MODULES ELECTRONIQUES A SEPARER ET PROCEDE DE PRODUCTION CORRESPONDANT

Publication

EP 1481423 A2 20041201 (DE)

Application

EP 03717135 A 20030306

Priority

  • DE 0300729 W 20030306
  • DE 10209922 A 20020307

Abstract (en)

[origin: WO03075347A2] The invention relates to an electronic module consisting of electronic components which are disposed in vertically staggered layers (21, 22, 23) that are electro-conductively connected to each other by means of open areas (102) of contact peak points (12) or bond joints (10) inside the respective components and by strip conductors (83) which are connected to said open areas and arranged between the layers of the components. The invention also relates to a method for the production of an electronic module, either in a panel or in the form of individual components.

IPC 1-7

H01L 25/065; H01L 25/10; H01L 21/98; H01L 25/16

IPC 8 full level

H01L 25/065 (2006.01); H01L 25/16 (2006.01)

CPC (source: EP US)

H01L 24/97 (2013.01 - EP US); H01L 25/0652 (2013.01 - EP US); H01L 25/16 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/92247 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/19105 (2013.01 - EP US)

Citation (search report)

See references of WO 03075347A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 03075347 A2 20030912; WO 03075347 A3 20031204; DE 10209922 A1 20031002; EP 1481423 A2 20041201; US 2005052830 A1 20050310; US 7276785 B2 20071002

DOCDB simple family (application)

DE 0300729 W 20030306; DE 10209922 A 20020307; EP 03717135 A 20030306; US 93454904 A 20040907