Global Patent Index - EP 1482063 A1

EP 1482063 A1 20041201 - Processing copper-magnesium alloys and improved copper alloy wire

Title (en)

Processing copper-magnesium alloys and improved copper alloy wire

Title (de)

Herstellung von Kupfer-Magnesium-Legierungen und verbesserter Kupfer-Draht

Title (fr)

Fabrication d'alliages de cuivre-magnésium et fil de cuivre amelioré

Publication

EP 1482063 A1 20041201 (EN)

Application

EP 03292667 A 20031024

Priority

US 44571703 A 20030527

Abstract (en)

A copper alloy wire comprises copper alloy containing 0.05-0.9 wt.% magnesium and more than 15 ppm impurities. It has a single end diameter of 0.01 inches, tensile strength of >=100 ksi and an electroconductivity of >60% international annealed copper standard. An independent claim is also included for a process for manufacturing a copper alloy wire comprising: (a) providing a base material formed from a copper alloy; (b) cold working the base material into a wire having >= 40% reduction in original cross-section area; (c) performing a restructuring anneal after the cold working step; and (d) cold working the annealed material into a wire having a final gage of not >0.01 inches.

IPC 1-7

C22C 9/00; C22F 1/08

IPC 8 full level

C22C 9/00 (2006.01); C22F 1/00 (2006.01); C22F 1/08 (2006.01)

CPC (source: EP US)

C22C 9/00 (2013.01 - EP US); C22F 1/08 (2013.01 - EP US)

Citation (search report)

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Designated contracting state (EPC)

DE FR GB IT TR

DOCDB simple family (publication)

EP 1482063 A1 20041201; CN 1574107 A 20050202; JP 2004353081 A 20041216; JP 2008095202 A 20080424; US 2004238086 A1 20041202

DOCDB simple family (application)

EP 03292667 A 20031024; CN 200410047605 A 20040527; JP 2004105908 A 20040331; JP 2007289672 A 20071107; US 44571703 A 20030527