EP 1482576 A2 20041201 - Hole transport material and method of manufacturing the hole transport material
Title (en)
Hole transport material and method of manufacturing the hole transport material
Title (de)
Lochleitermaterial und Herstellungsmethode
Title (fr)
Matériau de transport de trous et procédé de fabrication
Publication
Application
Priority
- JP 2003153539 A 20030529
- JP 2003206953 A 20030808
Abstract (en)
In an organic EL device, when a voltage is applied across an anode and a cathode, holes are moved in a hole transport layer and electrons are moved in an electron transport layer, and the holes and the electrons are recombined in a light emitting layer. In the light emitting layer, excitons are produced by energy released upon the recombination, and the excitons release energy in the form of fluorescence or phosphorescence or emit light when returning to the ground state. The hole transport material is used in the hole transport layer, in which the amount of cationic impurities and/or the amount of anionic impurities are controlled to be small, so that the decrease of light-emission luminance of the organic EL device is suppressed and excellent light emitting properties are maintained for a long period of time.
A hole transport material has sulfate ions of = 1,000 parts per million when used in forming layer. An independent claim is included for manufacture of hole transport material for layer used in transporting holes in organic electroluminescent device (1) comprising preparing liquid where a hole transport material is dissolved or dispersed in solvent or dispersion medium, eliminating sulfate ions in the liquid by eliminating mechanism that separates or eliminates the sulfate ions and removing solvent or dispersion medium from the liquid so refining the hole transport material.
IPC 1-7
IPC 8 full level
C09K 11/06 (2006.01); H01L 51/30 (2006.01); H01L 51/40 (2006.01); H01L 51/50 (2006.01)
CPC (source: EP KR US)
C09K 11/06 (2013.01 - KR); H10K 50/14 (2023.02 - EP KR US); H10K 50/15 (2023.02 - KR); H10K 71/12 (2023.02 - EP KR US); H10K 85/1135 (2023.02 - EP KR US); Y10S 428/917 (2013.01 - KR)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1482576 A2 20041201; EP 1482576 A3 20060322; CN 1575077 A 20050202; JP 2005044615 A 20050217; JP 4281442 B2 20090617; KR 100589969 B1 20060619; KR 20040103389 A 20041208; TW 200507452 A 20050216; TW I242324 B 20051021; US 2005062012 A1 20050324
DOCDB simple family (application)
EP 04253063 A 20040525; CN 200410046409 A 20040528; JP 2003206953 A 20030808; KR 20040038037 A 20040528; TW 93115128 A 20040527; US 85464704 A 20040527