Global Patent Index - EP 1483723 A1

EP 1483723 A1 2004-12-08 - METHODS AND APPARATUS FOR FABRICATING CHIP-ON-BOARD MODULES

Title (en)

METHODS AND APPARATUS FOR FABRICATING CHIP-ON-BOARD MODULES

Title (de)

VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON CHIP-ON-BOARD-MODULEN

Title (fr)

PROCEDES ET DISPOSITIF POUR FABRIQUER DES MODULES PUCE SUR CARTE

Publication

EP 1483723 A1 (EN)

Application

EP 03716193 A

Priority

  • US 0305846 W
  • US 36003602 P

Abstract (en)

[origin: CA2477763A1] A method of assembling a Chip-on-Board memory module as shown in Fig. 1, the method may be divided into several area or steps, mounting (step 100), patching (step 110), testing (step 120), and covering (step 130). During mounting (step 100), preferably, at least one unpackaged chip is mounted on a printing circuit board. In some embodiments, a selectively settable material may used to mount unpackaged memory parts. When mounting die on PC (step 101 ), a ring of selectively settable material is preferably used to surround the d ie and hold the die in place. Once mounted the alignment of each unpackaged chi p may be adjusted (step 102), after which the ring selectively settable materi al disposed around the chip is cured or hardened (step 103). The hardened ring around each die keeps the die in place. In some embodiments, the ring is higher than the die it surround to facilitate the addition of bond wires.</S DOAB>

IPC 1-7 (main, further and additional classification)

G06F 19/00

IPC 8 full level (invention and additional information)

H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01)

CPC (invention and additional information)

H01L 23/3185 (2013.01); B82Y 10/00 (2013.01); G11C 29/022 (2013.01); H01L 22/20 (2013.01); H01L 23/3192 (2013.01); H01L 23/562 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48 (2013.01); H01L 2224/4899 (2013.01); H01L 2224/49 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3025 (2013.01); H05K 1/029 (2013.01); H05K 1/181 (2013.01); H05K 3/225 (2013.01); H05K 2201/10159 (2013.01); H05K 2203/162 (2013.01)

Combination set (CPC)

  1. H01L 2924/3025 + H01L 2924/00
  2. H01L 2924/14 + H01L 2924/00
  3. H01L 2224/48 + H01L 2924/00
  4. H01L 2224/49 + H01L 2924/00

Citation (search report)

See references of WO 03073357A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

EPO simple patent family

AU 2003219909 A1 20030909; CA 2477763 A1 20030904; EP 1483723 A1 20041208; KR 20040096611 A 20041116; KR 20050004787 A 20050112

INPADOC legal status


2008-08-06 [18W] APPLICATION WITHDRAWN

- Effective date: 20080624

2005-07-13 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: CELETRONIX INTERNATIONAL, LTD

2005-07-13 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: CELETRONIX USA, INC.

2004-12-08 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20040830

2004-12-08 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

2004-12-08 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO:

- Countries: AL LT LV MK RO