EP 1483723 A1 20041208 - METHODS AND APPARATUS FOR FABRICATING CHIP-ON-BOARD MODULES
Title (en)
METHODS AND APPARATUS FOR FABRICATING CHIP-ON-BOARD MODULES
Title (de)
VERFAHREN UND VORRICHTUNG ZUR HERSTELLUNG VON CHIP-ON-BOARD-MODULEN
Title (fr)
PROCEDES ET DISPOSITIF POUR FABRIQUER DES MODULES PUCE SUR CARTE
Publication
Application
Priority
- US 0305846 W 20030224
- US 36003602 P 20020226
Abstract (en)
[origin: CA2477763A1] A method of assembling a Chip-on-Board memory module as shown in Fig. 1, the method may be divided into several area or steps, mounting (step 100), patching (step 110), testing (step 120), and covering (step 130). During mounting (step 100), preferably, at least one unpackaged chip is mounted on a printing circuit board. In some embodiments, a selectively settable material may used to mount unpackaged memory parts. When mounting die on PC (step 101 ), a ring of selectively settable material is preferably used to surround the d ie and hold the die in place. Once mounted the alignment of each unpackaged chi p may be adjusted (step 102), after which the ring selectively settable materi al disposed around the chip is cured or hardened (step 103). The hardened ring around each die keeps the die in place. In some embodiments, the ring is higher than the die it surround to facilitate the addition of bond wires.</S DOAB>
IPC 1-7
IPC 8 full level
H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01)
CPC (source: EP KR)
B82Y 10/00 (2013.01 - EP); G11C 29/022 (2013.01 - EP); H01L 22/20 (2013.01 - EP); H01L 23/3185 (2013.01 - EP); H01L 23/3192 (2013.01 - EP); H01L 23/50 (2013.01 - KR); H01L 23/562 (2013.01 - EP); H01L 2224/05554 (2013.01 - EP); H01L 2224/48 (2013.01 - EP); H01L 2224/4899 (2013.01 - EP); H01L 2224/49 (2013.01 - EP); H01L 2224/49175 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2224/8592 (2013.01 - EP); H01L 2924/01055 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/3025 (2013.01 - EP); H05K 1/029 (2013.01 - EP); H05K 1/181 (2013.01 - EP); H05K 3/225 (2013.01 - EP); H05K 2201/10159 (2013.01 - EP); H05K 2203/162 (2013.01 - EP)
Citation (search report)
See references of WO 03073357A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
AU 2003219909 A1 20030909; CA 2477763 A1 20030904; EP 1483723 A1 20041208; KR 20040096611 A 20041116; KR 20050004787 A 20050112
DOCDB simple family (application)
AU 2003219909 A 20030224; CA 2477763 A 20030224; EP 03716193 A 20030224; KR 20047013210 A 20030224; KR 20047013249 A 20030224