EP 1483785 A1 20041208 - METHOD AND APPARATUS FOR INTEGRATED CHEMICAL MECHANICAL POLISHING OF COPPER AND BARRIER LAYERS
Title (en)
METHOD AND APPARATUS FOR INTEGRATED CHEMICAL MECHANICAL POLISHING OF COPPER AND BARRIER LAYERS
Title (de)
VERFAHREN UND GERÄT ZUM INTEGRIERTEN CHEMISCH-MECHANISCHEN POLIEREN VON KUPFER- UND BARRIERESCHICHT
Title (fr)
PROCEDE ET APPAREIL DE POLISSAGE CHIMICO-MECANIQUE INTEGRE DU CUIVRE, ET COUCHES BARRIERE
Publication
Application
Priority
- GB 0301066 W 20030313
- US 36500102 P 20020313
- US 19947102 A 20020719
- US 41754402 P 20021010
- US 34642503 A 20030117
Abstract (en)
[origin: WO03079428A1] A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer such as copper using a polishing solution on a first portion of polishing pad and polishing another layer as a barrier layer using a polishing solution on another portion of polishing pad. Different or identical solutions may be used for each layer. The different portions of polishing pad, likewise, are preferably suited to polish a corresponding wafer layer. The different portions of polishing pad may be located on the same pad or on different pads. Also claimed are two different supply lines of polishing solutions to a single polishing pad.
IPC 1-7
IPC 8 full level
B24B 21/04 (2006.01); B24B 37/04 (2006.01); B24B 49/16 (2006.01); H01L 21/321 (2006.01)
CPC (source: EP US)
B24B 21/04 (2013.01 - EP US); B24B 37/04 (2013.01 - EP US); B24B 49/16 (2013.01 - EP US); H01L 21/3212 (2013.01 - EP US)
Citation (search report)
See references of WO 03079428A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03079428 A1 20030925; AU 2003224233 A1 20030929; CN 1653600 A 20050810; EP 1483785 A1 20041208; TW 200308007 A 20031216; US 2004023607 A1 20040205
DOCDB simple family (application)
GB 0301066 W 20030313; AU 2003224233 A 20030313; CN 03810974 A 20030313; EP 03720656 A 20030313; TW 92105543 A 20030313; US 38769803 A 20030313