EP 1485944 B1 20120613 - RADIATION ASSISTED DIRECT IMPRINT LITHOGRAPHY
Title (en)
RADIATION ASSISTED DIRECT IMPRINT LITHOGRAPHY
Title (de)
STRAHLUNGSUNTERSTÜTZTE DIREKTDRUCKLITHOGRAPHIE
Title (fr)
LITHOGRAPHIE A IMPRESSION DIRECTE ASSISTEE PAR IRRADIATION
Publication
Application
Priority
- US 0308293 W 20030317
- US 36465302 P 20020315
- US 14014002 A 20020507
Abstract (en)
[origin: WO03079416A1] In accordance with the invention, features can be directly imprinted into the surface of a solid substrate. Specifically, a substrate is directly imprinted with a desired pattern by the steps of providing a mold (20) having a molding surface (21) to imprint the pattern, disposing the molding surface adjacent or against the substrate (24) surface (25) to be imprinted, and irradiating the substrate surface with radiation to soften or liquefy the surface. The molding surface is pressed into the softened or liquefied surface to directly imprint the substrate. The substrate can be any one of a wide variety of solid materials such as semiconductors, metals, or polymers. In a preferred embodiment the substrate is silicon, the laser is a UV laser, and the mold is transparent to the UV radiation to permit irradiation of the silicon workpiece through the transparent mold. Using this method, applicants have directly imprinted into silicon large area patterns with sub-10 nanometer resolution in sub-250 nanosecond processing time. The method can also be used with a flat molding surface to planarize the substrate.
IPC 8 full level
B82Y 10/00 (2011.01); G03F 7/00 (2006.01); H01L 21/00 (2006.01); H01L 21/027 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP)
B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); H01L 21/304 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03079416 A1 20030925; AU 2003230676 A1 20030929; CN 100373528 C 20080305; CN 1643650 A 20050720; EP 1485944 A1 20041215; EP 1485944 A4 20060607; EP 1485944 B1 20120613; JP 2005521243 A 20050714; JP 4276087 B2 20090610
DOCDB simple family (application)
US 0308293 W 20030317; AU 2003230676 A 20030317; CN 03806118 A 20030317; EP 03723766 A 20030317; JP 2003577316 A 20030317