EP 1487017 A2 20041215 - Thermally Enhanced Substrate for a BGA
Title (en)
Thermally Enhanced Substrate for a BGA
Title (de)
Thermisch verbessertes Substrat für ein "BGA"
Title (fr)
Substrat de tenue thermique améliorée pour un "BGA"
Publication
Application
Priority
US 45914003 A 20030610
Abstract (en)
An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.
IPC 1-7
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/498 (2006.01)
CPC (source: EP US)
H01L 23/3677 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48228 (2013.01 - EP US); H01L 2224/48237 (2013.01 - EP US); H01L 2224/49175 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01087 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15173 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (examination)
- US 6232650 B1 20010515 - FUJISAWA ATSUSHI [JP], et al
- JP 2003051511 A 20030221 - HITACHI LTD, et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1487017 A2 20041215; EP 1487017 A3 20090708; CN 100375272 C 20080312; CN 1574308 A 20050202; HK 1073926 A1 20051021; US 2004253767 A1 20041216; US 7109573 B2 20060919
DOCDB simple family (application)
EP 04102546 A 20040604; CN 200410049317 A 20040610; HK 05106334 A 20050725; US 45914003 A 20030610