EP 1487602 A2 20041222 - METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES
Title (en)
METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES
Title (de)
VERFAHREN UND SYSTEM ZUR HOCHGESCHWINDIGKEITS PRÄZISIONSMIKROBEARBEITUNG EINER ANORDNUNG VON BAULELEMENTEN
Title (fr)
PROCEDE ET SYSTEME POUR MICRO-USINAGE PRECIS, A GRANDE VITESSE D'UN RESEAU DE DISPOSITIFS
Publication
Application
Priority
- US 0309323 W 20030327
- US 36842102 P 20020328
Abstract (en)
[origin: WO03082507A2] A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
IPC 1-7
IPC 8 full level
B23K 26/00 (2006.01); B23K 26/38 (2014.01); H01C 17/22 (2006.01); H01C 17/242 (2006.01)
CPC (source: EP KR)
B23K 26/351 (2015.10 - EP KR); H01C 17/242 (2013.01 - EP KR)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03082507 A2 20031009; WO 03082507 A3 20040715; AU 2003218419 A1 20031013; AU 2003218419 A8 20031013; EP 1487602 A2 20041222; EP 1487602 A4 20080319; JP 2005522023 A 20050721; JP 5087205 B2 20121205; KR 100826633 B1 20080502; KR 20040104556 A 20041210; TW 200305891 A 20031101; TW I223284 B 20041101
DOCDB simple family (application)
US 0309323 W 20030327; AU 2003218419 A 20030327; EP 03714419 A 20030327; JP 2003580024 A 20030327; KR 20047015434 A 20030327; TW 92106952 A 20030327