Global Patent Index - EP 1488065 A1

EP 1488065 A1 20041222 - PROFILED SYSTEM

Title (en)

PROFILED SYSTEM

Title (de)

PROFILANORDNUNG

Title (fr)

SYSTEME PROFILE

Publication

EP 1488065 A1 20041222 (DE)

Application

EP 03720180 A 20030314

Priority

  • DE 0300836 W 20030314
  • DE 10212341 A 20020314

Abstract (en)

[origin: US2005181176A1] An arrangement of at least two profile sections ( 2, 3, 8, 9 ) connected with one another by means of an insulating chamber ( 1, 13 ), whereby at least the surface of the side of at least one profile section ( 3, 9 ) that is turned away from the insulating chamber ( 1, 13 ), compared to the surface of a side that is turned toward the insulating chamber ( 1, 13 ) is enlarged in order to render a facilitated thermal transfer between the surroundings and the side of the profile section ( 3, 9 ) that is turned away from the insulating chamber ( 1, 13 ) possible.

IPC 1-7

E06B 7/12

IPC 8 full level

E04D 3/08 (2006.01); E06B 7/12 (2006.01); E06B 3/263 (2006.01)

CPC (source: EP US)

E04D 3/08 (2013.01 - EP US); E06B 7/12 (2013.01 - EP US); E04D 2003/0837 (2013.01 - EP US); E04D 2003/0893 (2013.01 - EP US); E06B 3/263 (2013.01 - EP US); Y10T 428/24537 (2015.01 - EP US)

Citation (search report)

See references of WO 03078779A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

US 2005181176 A1 20050818; AT E470778 T1 20100615; AU 2003223873 A1 20030929; DE 10212341 C1 20030424; DE 10391015 D2 20050210; DE 50312797 D1 20100722; EP 1488065 A1 20041222; EP 1488065 B1 20100609; WO 03078779 A1 20030925

DOCDB simple family (application)

US 50767505 A 20050414; AT 03720180 T 20030314; AU 2003223873 A 20030314; DE 0300836 W 20030314; DE 10212341 A 20020314; DE 10391015 T 20030314; DE 50312797 T 20030314; EP 03720180 A 20030314