EP 1490894 A1 20041229 - METHOD FOR PROCESSING ELECTRICAL COMPONENTS, ESPECIALLY SEMICONDUCTOR CHIPS, AND DEVICE FOR CARRYING OUT THE METHOD
Title (en)
METHOD FOR PROCESSING ELECTRICAL COMPONENTS, ESPECIALLY SEMICONDUCTOR CHIPS, AND DEVICE FOR CARRYING OUT THE METHOD
Title (de)
VERFAHREN ZUM VERARBEITEN VON ELEKTRISCHEN BAUELEMENTEN, INSBESONDERE VON HALBLEITERCHIPS, SOWIE VORRICHTUNG ZUM DURCHF HREN DES VERFAHRENS
Title (fr)
PROCEDE DE TRAITEMENT DE COMPOSANTS ELECTRIQUES, NOTAMMENT DE PUCES A SEMI-CONDUCTEUR ET DISPOSITIF POUR METTRE LEDIT PROCEDE EN OEUVRE
Publication
Application
Priority
- DE 0301058 W 20030402
- DE 10214969 A 20020404
- DE 10218384 A 20020424
- DE 10225097 A 20020605
Abstract (en)
[origin: WO03085702A1] The invention relates to a novel method for processing electrical components, especially semiconductor chips, which are respectively held in a detachable manner - as groups consisting of at least two components - by a first side thereof on a first carrier material of a first carrier.
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP US)
H01L 21/67132 (2013.01 - EP US); H01L 21/67144 (2013.01 - EP US); H01L 24/75 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); Y10T 29/49133 (2015.01 - EP US); Y10T 29/53187 (2015.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 03085702A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03085702 A1 20031016; AU 2003232588 A1 20031020; EP 1490894 A1 20041229; JP 2005522046 A 20050721; US 2005204554 A1 20050922
DOCDB simple family (application)
DE 0301058 W 20030402; AU 2003232588 A 20030402; EP 03745743 A 20030402; JP 2003582794 A 20030402; US 50894805 A 20050511