EP 1490906 A1 20041229 - BEOL PROCESS FOR CU METALLIZATIONS FREE FROM AL-WIREBOND PADS
Title (en)
BEOL PROCESS FOR CU METALLIZATIONS FREE FROM AL-WIREBOND PADS
Title (de)
BEOL-PROZESS FÜR CU-METALLISIERUNGEN OHNE AL-DRAHTBONDKONTAKTFLÄCHEN
Title (fr)
PROCEDE BEOL POUR METALLISATIONS DE CU DEPOURVUES DE PLAGES DE CONNEXION EN AL
Publication
Application
Priority
US 0210409 W 20020402
Abstract (en)
[origin: WO03085735A1] A process of making an interconnection structure of Cu FBEOL semiconductor devices that does not rely upon Al-wirebond pads which require additional patterning steps (for Al-via to Cu, Al-pad), comprising: a) providing a substrate having Cu wires and Cu pads embedded therein; b) selectively depositing a first metallic passivation layer on the top copper surfaces sufficient to prevent Cu oxidation and/or Cu out diffusion; c) depositing a final passivation layer; d) employing lithography and etching of the final passivation layer to cause pad opening of the fuses by exposing the passivated Cu in the bond pad area and in the fuse area; and e) causing additional passivation of open pad and open fuse areas by selective immersion deposition of Au.
IPC 1-7
IPC 8 full level
H01L 21/3205 (2006.01); H01L 21/60 (2006.01); H01L 21/82 (2006.01); H01L 23/485 (2006.01); H01L 23/52 (2006.01); H01L 23/525 (2006.01); H01L 23/532 (2006.01)
CPC (source: EP)
H01L 23/5256 (2013.01); H01L 23/53238 (2013.01); H01L 24/05 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48824 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19042 (2013.01)
Citation (search report)
See references of WO 03085735A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 03085735 A1 20031016; AU 2002250505 A1 20031020; EP 1490906 A1 20041229; JP 2005522055 A 20050721
DOCDB simple family (application)
US 0210409 W 20020402; AU 2002250505 A 20020402; EP 02719422 A 20020402; JP 2003582819 A 20020402