Global Patent Index - EP 1495482 A2

EP 1495482 A2 20050112 - COMPLEX MICRODEVICES AND APPPARATUS AND METHODS FOR FABRICATING SUCH DEVICES

Title (en)

COMPLEX MICRODEVICES AND APPPARATUS AND METHODS FOR FABRICATING SUCH DEVICES

Title (de)

KOMPLEXE MIKROEINRICHTUNGEN UND VORRICHTUNGEN UND VERFAHREN ZUR HERSTELLUNG SOLCHER EINRICHTUNGEN

Title (fr)

MICRODISPOSITIFS COMPLEXES, APPAREIL ET PROCEDES DE FABRICATION DE CEUX-CI

Publication

EP 1495482 A2 20050112 (EN)

Application

EP 02786937 A 20021206

Priority

  • US 0239146 W 20021206
  • US 34037201 P 20011206
  • US 36426102 P 20020313
  • US 37913302 P 20020507
  • US 37918402 P 20020507
  • US 37913502 P 20020507
  • US 37917702 P 20020507
  • US 37918202 P 20020507
  • US 37913002 P 20020507
  • US 39253102 P 20020627
  • US 41537402 P 20021001
  • US 41537102 P 20021001
  • US 42200702 P 20021029
  • US 42298202 P 20021101
  • US 42948302 P 20021126
  • US 42948402 P 20021126
  • US 43080902 P 20021203
  • US 30952102 A 20021203

Abstract (en)

[origin: WO03050852A2] Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication EFAB TM

[origin: WO03050852A2] Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB <sp>TM</sp>)

IPC 1-7

H01L 21/00

IPC 8 full level

B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01); H01P 3/06 (2006.01); H01P 5/18 (2006.01); H01P 11/00 (2006.01)

CPC (source: EP)

B81B 7/02 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); H01P 3/06 (2013.01); H01P 5/183 (2013.01); H01P 11/00 (2013.01); H01P 11/005 (2013.01); B81B 2201/042 (2013.01)

Citation (search report)

See references of WO 03050852A2

Citation (examination)

BARRON C.C. ET AL: "Micromachined Silicon Seismic Accelerometer Development", CONFERENCE: 18. SEISMIC RESEARCH SYMPOSIUM ON MONITORING A COMPREHENSIVE TEST BAND TREATY (CTBT), ANNAPOLIS, MD (UNITED STATES), 4-6 SEP 1996, 30 July 1996 (1996-07-30), SANDIA NATIONAL LABORATORIES, ALBUQUERQUE, NM, USA

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR

DOCDB simple family (publication)

WO 03050852 A2 20030619; WO 03050852 A3 20041111; AU 2002351289 A1 20030623; EP 1495482 A2 20050112

DOCDB simple family (application)

US 0239146 W 20021206; AU 2002351289 A 20021206; EP 02786937 A 20021206