EP 1495501 A2 20050112 - HERMETIC ENCAPSULATION OF ORGANIC ELECTRO-OPTICAL ELEMENTS
Title (en)
HERMETIC ENCAPSULATION OF ORGANIC ELECTRO-OPTICAL ELEMENTS
Title (de)
HERMETISCHE VERKAPSELUNG VON ORGANISCHEN ELEKTRO-OPTISCHEN ELEMENTEN
Title (fr)
ENCAPSULAGE HERMETIQUE D'ELEMENTS ELECTRO-OPTIQUES ORGANIQUES
Publication
Application
Priority
- DE 20205830 U 20020415
- DE 10222958 A 20020523
- DE 10222964 A 20020523
- DE 10222609 A 20020523
- DE 10252787 A 20021113
- DE 10301559 A 20030116
- EP 0303883 W 20030415
Abstract (en)
[origin: WO03088370A2] The invention relates to a hermetic encapsulation of organic electro-optical elements. The aim of the invention is to improve the service life of the aforementioned organic, opto-electronic elements. The invention provides a method for producing said elements which comprises the steps of: providing a support (3), applying a first conductive layer (13), applying at least one layer (15) that comprises at least one organic, electro-optical material, applying a second conductive layer (17), and depositing at least one layer (7, 71, 72,..., 7N) having a glass-like structure.
IPC 1-7
IPC 8 full level
G02B 3/00 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01); C03B 19/00 (2006.01); C03C 4/12 (2006.01); C03C 14/00 (2006.01); C03C 15/00 (2006.01); C03C 17/02 (2006.01); C03C 17/34 (2006.01); C03C 27/02 (2006.01); C23C 14/10 (2006.01); H01L 21/027 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01L 21/312 (2006.01); H01L 21/316 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 51/50 (2006.01); H01L 51/52 (2006.01); H05B 33/04 (2006.01); H05B 33/10 (2006.01); H05B 33/24 (2006.01); H05B 33/26 (2006.01); H05B 33/28 (2006.01); H01L 23/498 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP)
B81C 1/00269 (2013.01); C03B 19/00 (2013.01); C03C 4/12 (2013.01); C03C 14/006 (2013.01); C03C 15/00 (2013.01); C03C 17/02 (2013.01); C03C 17/34 (2013.01); C23C 14/10 (2013.01); H01L 21/02145 (2013.01); H01L 21/02161 (2013.01); H01L 21/02266 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 23/10 (2013.01); H01L 23/291 (2013.01); H01L 23/3114 (2013.01); H10K 50/8426 (2023.02); H10K 50/8445 (2023.02); B81C 2203/019 (2013.01); B81C 2203/031 (2013.01); C03C 2214/16 (2013.01); C03C 2217/21 (2013.01); C03C 2218/15 (2013.01); C03C 2218/32 (2013.01); C03C 2218/328 (2013.01); C03C 2218/33 (2013.01); C03C 2218/355 (2013.01); H01L 21/02129 (2013.01); H01L 23/49894 (2013.01); H01L 2224/16 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H05K 3/28 (2013.01); H10K 50/805 (2023.02); H10K 50/85 (2023.02); Y02P 40/57 (2015.11)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03088370 A2 20031023; WO 03088370 A3 20040617; AU 2003233974 A1 20031027; CA 2505014 A1 20031023; CN 1659720 A 20050824; DE 10222958 A1 20031030; DE 10222958 B4 20070816; EP 1495501 A2 20050112; JP 2005527076 A 20050908
DOCDB simple family (application)
EP 0303883 W 20030415; AU 2003233974 A 20030415; CA 2505014 A 20030415; CN 03813302 A 20030415; DE 10222958 A 20020523; EP 03727306 A 20030415; JP 2003585192 A 20030415