EP 1497373 A1 20050119 - THERMOSET COMPOSITION, METHOD, AND ARTICLE
Title (en)
THERMOSET COMPOSITION, METHOD, AND ARTICLE
Title (de)
THERMISCH AUSHAERTBARE ZUSAMMENSETZUNG, VERFAHREN UND ARTIKEL
Title (fr)
COMPOSITION THERMODURCIE, PROCEDE ET ARTICLES ASSOCIES
Publication
Application
Priority
- US 0310784 W 20030407
- US 11940602 A 20020409
Abstract (en)
[origin: US2003215588A1] A curable composition includes a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a polymeric additive effective selected from polystyrene, poly(styrene-maleic anhydride), poly(styrene-methyl methacrylate), polybutene, poly(ethylene-butylene), poly(vinyl ether), poly(vinyl acetate), and combinations thereof. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.
IPC 1-7
IPC 8 full level
C08L 71/00 (2006.01); B32B 1/00 (2024.01); C08F 279/02 (2006.01); C08F 283/08 (2006.01); C08G 65/48 (2006.01); C08K 3/00 (2006.01); C08K 5/00 (2006.01); C08L 71/12 (2006.01); C08L 101/00 (2006.01); C08L 23/18 (2006.01)
CPC (source: EP US)
C08F 279/02 (2013.01 - EP US); C08F 283/08 (2013.01 - EP US); C08G 65/485 (2013.01 - EP US); C08L 71/126 (2013.01 - EP US); C08G 2650/04 (2013.01 - EP US); C08L 23/18 (2013.01 - EP US); Y10T 428/13 (2015.01 - EP US); Y10T 428/1352 (2015.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
US 2003215588 A1 20031120; AT E353355 T1 20070215; CN 1659232 A 20050824; DE 60311644 D1 20070322; DE 60311644 T2 20071122; EP 1497373 A1 20050119; EP 1497373 B1 20070207; ES 2280746 T3 20070916; JP 2005522553 A 20050728; US 2003220460 A1 20031127; US 7205035 B2 20070417; WO 03087224 A1 20031023
DOCDB simple family (application)
US 11940602 A 20020409; AT 03723940 T 20030407; CN 03813254 A 20030407; DE 60311644 T 20030407; EP 03723940 A 20030407; ES 03723940 T 20030407; JP 2003584174 A 20030407; US 0310784 W 20030407; US 24875603 A 20030214