EP 1498982 A1 20050119 - A dielectric substrate single layer planar dipole antenna
Title (en)
A dielectric substrate single layer planar dipole antenna
Title (de)
Planare Dipolantenne auf einem einschichtigen dielektrischen Substrat
Title (fr)
Antenne dipôle plane imprimée sur un substrat diélectrique à couche unique
Publication
Application
Priority
IT RE20030073 A 20030718
Abstract (en)
A dielectric substrate single layer planar dipole antenna comprises at least a radiant dipolar element made of two strips (1) having any shape such as linear, spiral, meander or like, printed on the front side of a thin dielectric substrate. On the back side of the said substrate a planar balanced feeding structure (balun) is implemented using a slot (4) etched on a thin metallic patch locally performing as ground plane (2). <??>Two metallized via-holes or rivets (3) very near to the edges of said slot (4) connect the radiating strips (1) to the ground plane. The two via-holes are disposed symmetrically with respect to the slot centre. A third feeding strip (5), etched on the same side of the said radiating strips, bridges over the centre of said slot and is connected to the ground through a via-hole (3) very near the slot edge. This third strip (5) constitutes the unbalanced input port of the balanced antenna, suitable for connecting the inner conductor of a coaxial cable whose outer conductor can be directly or indirectly connected to the ground plane. <IMAGE>
IPC 1-7
H01Q 1/38; H01Q 9/28; H01Q 9/04; H01P 5/10; H01P 5/12; H01Q 9/06
IPC 8 full level
H01P 5/10 (2006.01); H01Q 1/38 (2006.01); H01Q 9/06 (2006.01); H01Q 9/28 (2006.01)
CPC (source: EP)
H01P 5/10 (2013.01); H01Q 1/38 (2013.01); H01Q 9/065 (2013.01); H01Q 9/285 (2013.01)
Citation (search report)
- [XY] EP 1041671 A1 20001004 - MITSUBISHI ELECTRIC CORP [JP]
- [A] DE 2020192 A1 19711104 - SIEMENS AG
- [A] EP 1154513 A1 20011114 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [Y] MENZEL W ET AL: "A MICROSTRIP PATCH ANTENNA WITH COPLANAR FEED LINE", IEEE MICROWAVE AND GUIDED WAVE LETTERS, IEEE INC, NEW YORK, US, vol. 1, no. 11, 1 November 1991 (1991-11-01), pages 340 - 342, XP000230628, ISSN: 1051-8207
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 04011740 A 20040518; IT RE20030073 A 20030718