Global Patent Index - EP 1500113 A1

EP 1500113 A1 20050126 - ENAMELED WIRE HAVING MAGNETIC RELUCTANCE PROPERTIES AND PREPARATION METHOD THEREOF, AND COIL USING THE SAME AND PREPARATION METHOD THEREOF

Title (en)

ENAMELED WIRE HAVING MAGNETIC RELUCTANCE PROPERTIES AND PREPARATION METHOD THEREOF, AND COIL USING THE SAME AND PREPARATION METHOD THEREOF

Title (de)

EMAILLIERTER DRAHT MIT MAGNETISCHEN RELUKTANZEIGENSCHAFTEN UND HERSTELLUNGSVERFAHREN DAFÜR UND SPULE DAMIT UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

FIL EMAILLE A RESISTANCE MAGNETIQUE ET PROCEDE DE FABRICATION ASSOCIE, ENROULEMENT CONSTITUE DE CE FIL ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 1500113 A1 20050126 (EN)

Application

EP 03715831 A 20030412

Priority

  • KR 0300744 W 20030412
  • KR 20020019934 A 20020412
  • KR 20030023238 A 20030412

Abstract (en)

[origin: WO03088282A1] Disclosed herein is a magnetoresistant enameled wire coated with a material which shows improved conductivity by reducing resistance of a conductor since the wire exhibits effects similar to anisotropic magnetoresistance of magnetic materials when manufactured in the form of a coil. The material also shows effects similar to magnetoresistance exhibiting a strong magnetic flux density. Disclosed further are a method for manufacturing the magnetoresistant enameled wire, a magnetoresistant coil using the magnetoresistant wire, and a method for manufacturing the magnetoresistant coil.

IPC 1-7

H01F 5/00

IPC 8 full level

H01B 3/42 (2006.01); H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 7/04 (2006.01); H01B 7/17 (2006.01); H01B 11/06 (2006.01); H01B 13/00 (2006.01); H01F 27/00 (2006.01); H01F 5/00 (2006.01)

CPC (source: EP US)

H01B 7/0009 (2013.01 - EP US); H01B 7/0208 (2013.01 - EP US); H01F 5/00 (2013.01 - EP US); Y10T 428/2933 (2015.01 - EP US)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 03088282 A1 20031023; AU 2003221138 A1 20031027; EP 1500113 A1 20050126; EP 1500113 A4 20080730; JP 2005522840 A 20050728; US 2006165983 A1 20060727

DOCDB simple family (application)

KR 0300744 W 20030412; AU 2003221138 A 20030412; EP 03715831 A 20030412; JP 2003585123 A 20030412; US 51140705 A 20050708