EP 1500130 A1 20050126 - PARTIALLY PATTERNED LEAD FRAMES AND METHODS OF MAKING AND USING THE SAME IN SEMICONDUCTOR PACKAGING
Title (en)
PARTIALLY PATTERNED LEAD FRAMES AND METHODS OF MAKING AND USING THE SAME IN SEMICONDUCTOR PACKAGING
Title (de)
TEILWEISE STRUKTURIERTE ANSCHLUSSKÄMME UND VERFAHREN ZUR HERSTELLUNG UND VERWENDUNG DIESER BEI DER HALBLEITERKAPSELUNG
Title (fr)
CADRES DE MONTAGE PARTIELLEMENT STRUCTURES ET PROCEDES DE PRODUCTION ET D'UTILISATION DE CES DERNIERS DANS LE CONDITIONNEMENT DE SEMI-CONDUCTEURS
Publication
Application
Priority
- US 0313046 W 20030428
- US 13488202 A 20020429
- US 34273203 A 20030115
Abstract (en)
[origin: WO03103038A1] A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal (100) formed into a web-like lead frame on one side. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts (113) only after the front side, including the chip (140) and wires (160), is hermetically sealed. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal.
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP KR)
H01L 21/4832 (2013.01 - EP); H01L 21/4842 (2013.01 - EP); H01L 21/561 (2013.01 - EP); H01L 23/28 (2013.01 - KR); H01L 23/3114 (2013.01 - EP); H01L 23/48 (2013.01 - KR); H01L 23/495 (2013.01 - KR); H01L 23/49548 (2013.01 - EP); H01L 24/97 (2013.01 - EP); H01L 24/45 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/49 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 2224/1134 (2013.01 - EP); H01L 2224/131 (2013.01 - EP); H01L 2224/16245 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/45014 (2013.01 - EP); H01L 2224/45015 (2013.01 - EP); H01L 2224/45124 (2013.01 - EP); H01L 2224/45147 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48247 (2013.01 - EP); H01L 2224/49171 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2224/85205 (2013.01 - EP); H01L 2224/92247 (2013.01 - EP); H01L 2224/97 (2013.01 - EP); H01L 2924/00013 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01028 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/0105 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/014 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/18301 (2013.01 - EP); H01L 2924/351 (2013.01 - EP)
Citation (search report)
See references of WO 03103038A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03103038 A1 20031211; AU 2003239183 A1 20031219; CN 100380614 C 20080409; CN 1650410 A 20050803; EP 1500130 A1 20050126; JP 2005531137 A 20051013; KR 100789348 B1 20071228; KR 20050007350 A 20050117; TW 200405480 A 20040401; TW I239054 B 20050901
DOCDB simple family (application)
US 0313046 W 20030428; AU 2003239183 A 20030428; CN 03809358 A 20030428; EP 03733901 A 20030428; JP 2004510023 A 20030428; KR 20047017388 A 20030428; TW 92110007 A 20030429