EP 1500142 A2 20050126 - COMPONENT
Title (en)
COMPONENT
Title (de)
BAUELEMENT
Title (fr)
COMPOSANT
Publication
Application
Priority
- DE 0300787 W 20030312
- DE 10219353 A 20020430
Abstract (en)
[origin: WO03094234A2] The invention relates to a component, particularly a semiconductor component, comprising a first chip (10), which is placed on a second ship (20). The main surfaces (13, 23) of the first and second chips (10, 20) are respectively provided with first and second metallizations (12, 22) that face one another. First areas of the metallizations (12, 22) are provided for establishing an electrical connection between the first and second chip (10, 20). According to the invention, second areas of the metallizations (12, 22) are provided in the form of an additional electrical functional layer located outside of the first and second chips (10, 20).
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/544 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
H01L 22/34 (2013.01 - EP US); H01L 23/522 (2013.01 - EP US); H01L 23/544 (2013.01 - EP US); H01L 23/552 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 24/08 (2013.01 - EP); H01L 24/81 (2013.01 - US); H01L 25/0657 (2013.01 - EP US); H01L 24/05 (2013.01 - EP); H01L 24/80 (2013.01 - EP); H01L 2223/54473 (2013.01 - EP US); H01L 2224/05001 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/08123 (2013.01 - EP); H01L 2224/08145 (2013.01 - EP); H01L 2224/16145 (2013.01 - EP US); H01L 2224/81121 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2225/06513 (2013.01 - EP US); H01L 2225/06527 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US)
C-Set (source: EP US)
Citation (search report)
See references of WO 03094234A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03094234 A2 20031113; WO 03094234 A3 20040212; DE 10219353 A1 20031120; DE 10219353 B4 20070621; EP 1500142 A2 20050126; RU 2004134730 A 20050720; RU 2290718 C2 20061227; TW 200306660 A 20031116; TW I245403 B 20051211; US 2005121801 A1 20050609; US 7335582 B2 20080226
DOCDB simple family (application)
DE 0300787 W 20030312; DE 10219353 A 20020430; EP 03714696 A 20030312; RU 2004134730 A 20030312; TW 92105407 A 20030312; US 97454204 A 20041027