Global Patent Index - EP 1500715 A4

EP 1500715 A4 20050629 - METHOD FOR FORGING TITANIUM ALLOY AND FORGED TITANIUM ALLOY MATERIAL

Title (en)

METHOD FOR FORGING TITANIUM ALLOY AND FORGED TITANIUM ALLOY MATERIAL

Title (de)

VERFAHREN ZUM SCHMIEDEN VON TITANLEGIERUNG UND GESCHMIEDETES TITANLEGIERUNGSMATERIAL

Title (fr)

PROCEDE DE FORGEAGE D'ALLIAGE DE TITANE ET MATERIAU D'ALLIAGE DE TITANE FORGE

Publication

EP 1500715 A4 20050629 (EN)

Application

EP 02722818 A 20020426

Priority

JP 0204208 W 20020426

Abstract (en)

[origin: WO03091468A1] A method for forging a titanium alloy having a beta-transformation temperature of Tbeta(˚C), which comprises satisfying the relationships of (Tbeta - 400)˚C <= Tm and 400˚C <= Td <= 700˚C, wherein Tm and Td represent the temperature of a material to be forged and the temperature of a mold, respectively, and carrying out the forging of the alloy at a strain rate of 2 X 10<-4>S<-1> to 1 S<-1>, and preferably further satisfying the relationship of Tm - Td <= 250˚C and/or using a titanium alloy having a specific chemical composition. A titanium alloy material having been forged by the above method has a microstructure being fine and controlled so as to have a predetermined structure, and thus exhibits material properties being nearly uniform in the thickness direction thereof, is excellent in ductility and fatigue characteristics, is easy to finish the surface after forging, is less susceptible to cracking, and exhibits excellent formability.

IPC 1-7

C22F 1/18; C22C 14/00

IPC 8 full level

B21J 1/00 (2006.01); B21J 1/06 (2006.01); B21J 5/00 (2006.01); B21J 13/02 (2006.01); C22C 14/00 (2006.01); C22F 1/00 (2006.01); C22F 1/18 (2006.01)

CPC (source: EP US)

B21J 1/04 (2013.01 - EP US); B21J 1/06 (2013.01 - EP US); C22C 14/00 (2013.01 - EP US); C22F 1/183 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

US 2004244887 A1 20041209; EP 1500715 A1 20050126; EP 1500715 A4 20050629; JP WO2003091468 A1 20050902; WO 03091468 A1 20031106

DOCDB simple family (application)

US 47655403 A 20031216; EP 02722818 A 20020426; JP 0204208 W 20020426; JP 2003587991 A 20020426