EP 1502309 A1 20050202 - INTEGRATED CIRCUIT WITH INTERNAL IMPEDANCE MATCHING CIRCUIT
Title (en)
INTEGRATED CIRCUIT WITH INTERNAL IMPEDANCE MATCHING CIRCUIT
Title (de)
INTEGRIERTE SCHALTUNG MIT INTERNER IMPEDANZANPASSUNGSSCHALTUNG
Title (fr)
CIRCUIT INTEGRE AVEC CIRCUIT D'ADAPTATION D'IMPEDANCE INTERNE
Publication
Application
Priority
- US 0314893 W 20030508
- US 14225002 A 20020509
- US 42733003 A 20030501
Abstract (en)
[origin: WO03096439A1] An integrated circuit package (100) houses an connects to a die to form an integrated circuit (104) with internal matching (106). The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead (102). Bond wires connect select locations along the at least one transmission line to ground through impedance matching network (106) associated with at least one of the output leads. The package may also substantially encapsulate the lead frame, while exposing the die paddle and the input/output leads.
IPC 1-7
IPC 8 full level
H01L 21/822 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 27/04 (2006.01); H03F 1/56 (2006.01); H01L 23/522 (2006.01)
CPC (source: EP KR)
H01L 23/3107 (2013.01 - EP); H01L 23/49517 (2013.01 - EP); H01L 23/49541 (2013.01 - EP); H01L 23/49575 (2013.01 - EP); H01L 23/49589 (2013.01 - EP); H01L 23/50 (2013.01 - EP); H01L 23/552 (2013.01 - EP); H01L 23/64 (2013.01 - KR); H01L 23/66 (2013.01 - EP); H01L 24/06 (2013.01 - EP); H01L 24/49 (2013.01 - EP); H10N 60/00 (2023.02 - KR); H01L 23/5223 (2013.01 - EP); H01L 23/5227 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 2224/05553 (2013.01 - EP); H01L 2224/05599 (2013.01 - EP); H01L 2224/0603 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48247 (2013.01 - EP); H01L 2224/48253 (2013.01 - EP); H01L 2224/49111 (2013.01 - EP); H01L 2224/49171 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2224/85447 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01014 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/10329 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2924/18301 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19042 (2013.01 - EP); H01L 2924/19105 (2013.01 - EP); H01L 2924/30105 (2013.01 - EP); H01L 2924/3011 (2013.01 - EP); H01L 2924/30111 (2013.01 - EP)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 03096439 A1 20031120; AU 2003267226 A1 20031111; EP 1502309 A1 20050202; EP 1502309 A4 20080820; JP 2005524995 A 20050818; KR 20050006241 A 20050115
DOCDB simple family (application)
US 0314893 W 20030508; AU 2003267226 A 20030508; EP 03750119 A 20030508; JP 2004504309 A 20030508; KR 20047018046 A 20030508