Global Patent Index - EP 1502965 A1

EP 1502965 A1 20050202 - Free cutting brass alloy

Title (en)

Free cutting brass alloy

Title (de)

Messing mit guter Zerspanbarkeit.

Title (fr)

Laiton à usinage facile.

Publication

EP 1502965 A1 20050202 (EN)

Application

EP 04466021 A 20040729

Priority

CZ 20032094 A 20030801

Abstract (en)

The free cutting brass alloy on the basis of alloy Cu-Zn-Bi is designed primarily for hot and cold moulding, especially for manufacturing rods by cold drawing, and contains 55,0 % to 75,0 % by weight of copper, 0,5 % to 4,0 % by weight of bismuth, zinc residue and incidental tramp elements and impurities, such as 0,001 to 0,2 % by weight of lead and/or 0,001 to 0,3 % by weight of phosphor, 0,001 to 3,0 % by weight of silicon, 0,001 % to 2,0 % by weight of tin, a max. of 0,1 % by weight of aluminum, a max. of 0,4 % by weight of iron, a max. of 0,3 % by weight of nickel and a max. of 0,5 % by weight of other tramp elements on the whole.

IPC 1-7

C22C 9/04

IPC 8 full level

C22C 9/04 (2006.01)

CPC (source: EP)

C22C 9/04 (2013.01)

Citation (search report)

  • [X] EP 0457478 A1 19911121 - AMERICAN TELEPHONE & TELEGRAPH [US]
  • [X] US 5637160 A 19970610 - BROCK ANDREW J [US], et al
  • [Y] EP 1038981 A1 20000927 - SAMBO COPPER ALLOY CO LTD [JP]
  • [XY] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 20 10 July 2001 (2001-07-10)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 03 29 March 1996 (1996-03-29)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03)
  • [XP] PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1502965 A1 20050202; CZ 20032094 A3 20050413; CZ 294891 B6 20050413

DOCDB simple family (application)

EP 04466021 A 20040729; CZ 20032094 A 20030801