EP 1506329 A1 20050216 - METHODS AND APPARATUS FOR MONITORING DEPOSITION QUALITY DURING CONFORMABLE CONTACT MASK PLATING OPERATIONS
Title (en)
METHODS AND APPARATUS FOR MONITORING DEPOSITION QUALITY DURING CONFORMABLE CONTACT MASK PLATING OPERATIONS
Title (de)
VERFAHREN UND VORRICHTUNG ZUR ÜBERWACHUNG DER BESCHICHTUNGSQUALITÄT WÄHREND DES BESCHICHTUNGSVORGANGES IM KONFORMKONTAKTMASKENVERFAHREN
Title (fr)
PROCEDES ET APPAREIL DE SURVEILLANCE DE LA QUALITE DE DEPOT AU COURS D'OPERATIONS DE GALVANOPLASTIE EFFECTUEES A L'AIDE D'UN MASQUE DE CONTACT ADAPTABLE
Publication
Application
Priority
- US 0314859 W 20030507
- US 37913202 P 20020507
Abstract (en)
[origin: WO03095715A1] Electrochemical fabrication (e.g. EFAB) processes and apparatus are disclosed that provide monitoring of at least one electrical parameter (e.g. voltage) during selective deposition where the monitored parameter is used to help determine the quality of the deposition that was made. If the monitored parameter indicates that a problem occurred with the deposition, various remedial operations may be undertaken to allow successful formation of the structure to be completed.
IPC 1-7
IPC 8 full level
C25D 5/02 (2006.01); C25D 21/12 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); C25D 1/00 (2006.01); C25D 5/12 (2006.01); H01L 21/48 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP KR US)
B33Y 10/00 (2014.12 - EP KR US); C25D 1/003 (2013.01 - EP KR US); H01L 21/2885 (2013.01 - EP KR US); H01L 21/76879 (2013.01 - EP KR US); H01L 21/4857 (2013.01 - EP KR US); H05K 3/241 (2013.01 - EP KR US); H05K 3/243 (2013.01 - EP KR US)
Citation (search report)
See references of WO 03095715A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03095715 A1 20031120; AU 2003229025 A1 20031111; CN 100582318 C 20100120; CN 101724875 A 20100609; CN 1659317 A 20050824; EP 1506329 A1 20050216; JP 2005524775 A 20050818; JP 2010059550 A 20100318; JP 4434013 B2 20100317; JP 5198413 B2 20130515; KR 100994887 B1 20101116; KR 20050012738 A 20050202; US 2004000489 A1 20040101; US 2007181431 A1 20070809
DOCDB simple family (application)
US 0314859 W 20030507; AU 2003229025 A 20030507; CN 03813332 A 20030507; CN 200910246087 A 20030507; EP 03726805 A 20030507; JP 2004503699 A 20030507; JP 2009259258 A 20091112; KR 20047017799 A 20030507; US 43449403 A 20030507; US 73539307 A 20070413