EP 1508166 A2 20050223 - ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME
Title (en)
ELECTRONIC COMPONENT COMPRISING EXTERNAL SURFACE CONTACTS AND A METHOD FOR PRODUCING THE SAME
Title (de)
ELEKTRONISCHES BAUTEIL MIT USSEREN FL CHENKONTAKTEN UN D VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
COMPOSANT ELECTRONIQUE COMPRENANT DES CONTACTS DE SURFACE EXTERIEURS ET PROCEDE DE PRODUCTION DE CE COMPOSANT
Publication
Application
Priority
- DE 0301663 W 20030523
- DE 10224124 A 20020529
Abstract (en)
[origin: WO03103042A2] The invention relates to an electronic component (1) and a method for producing the same. Said component comprises external surface contacts (2) and a rewiring structure (3), in addition to a semiconductor chip (4) comprising contact surfaces (5). The external surface contacts (2) are electrically connected to the contact surfaces (5) at least by means of the rewiring structure (3) and the external surface contacts (2) and/or the rewiring structure (3) comprise(s) metal that has been deposited in a chemically or galvanically selective manner.
IPC 1-7
IPC 8 full level
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/68 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01)
CPC (source: EP US)
H01L 21/4846 (2013.01 - EP US); H01L 21/568 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 24/32 (2013.01 - EP US); H01L 25/105 (2013.01 - EP US); B29C 2043/5825 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/05571 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/06135 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP US); H01L 2224/16227 (2013.01 - EP US); H01L 2224/16503 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45015 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48472 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/81001 (2013.01 - EP US); H01L 2224/8181 (2013.01 - EP US); H01L 2224/83385 (2013.01 - EP US); H01L 2224/85424 (2013.01 - EP US); H01L 2225/1035 (2013.01 - EP US); H01L 2225/1058 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0132 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 03103042A2
Citation (examination)
- US 5976912 A 19991102 - FUKUTOMI NAOKI [JP], et al
- JP 2001044589 A 20010216 - NITTO DENKO CORP
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
WO 03103042 A2 20031211; WO 03103042 A3 20040408; DE 10224124 A1 20031218; EP 1508166 A2 20050223; US 2006091561 A1 20060504
DOCDB simple family (application)
DE 0301663 W 20030523; DE 10224124 A 20020529; EP 03755901 A 20030523; US 51561305 A 20050913