EP 1508916 A1 20050223 - Apparatus for cooling semiconductor devices attached to a printed circuit board
Title (en)
Apparatus for cooling semiconductor devices attached to a printed circuit board
Title (de)
Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten
Title (fr)
Appareil de refroidissement des dispositifs semiconducteurs monté sur des circuits imprimés
Publication
Application
Priority
EP 03018046 A 20030807
Abstract (en)
The invention proposes an apparatus for cooling semiconductor devices attached to a printed circuit board, comprising a printed circuit board having first and second sides, said first side having a semiconductor device attached thereto, said printed circuit board further comprising a plurality of apertures formed through said first and second sides; a cooling member adjacent said first side of the printed circuit board and being in thermal contact with the semiconductor device; a spring member adjacent said second side of the printed circuit board; and securing members connecting the spring member to the cooling member through said apertures in the printed circuit board such that the spring member providing a spring force forcing the semiconductor device against the cooling member. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 23/40 (2006.01); H01L 23/433 (2006.01)
CPC (source: EP US)
H01L 23/4006 (2013.01 - EP US); H01L 23/433 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
- [Y] US 2002051341 A1 20020502 - FRUTSCHY KRIS [US], et al
- [X] US 6256199 B1 20010703 - YUSUF IMRAN [US], et al
- [A] US 5307236 A 19940426 - RIO PASCAL [FR], et al
- [XY] RESEARCH DISCLOSURE, vol. 238, February 2001 (2001-02-01), pages 238 - 240, XP001103746
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1508916 A1 20050223; EP 1508916 B1 20080305; AT E388487 T1 20080315; DE 60319523 D1 20080417; DE 60319523 T2 20090326; US 2005128713 A1 20050616; US 7187553 B2 20070306
DOCDB simple family (application)
EP 03018046 A 20030807; AT 03018046 T 20030807; DE 60319523 T 20030807; US 91462404 A 20040809