EP 1511877 B1 20100915 - SPUTTER METHOD FOR THE PRODUCTION OF NATURAL VOLTAGE OPTIMIZED COATINGS
Title (en)
SPUTTER METHOD FOR THE PRODUCTION OF NATURAL VOLTAGE OPTIMIZED COATINGS
Title (de)
SPUTTERVERFAHREN ZUR HERSTELLUNG VON EIGENSPANNUNGSOPTIMIERTEN BESCHICHTUNGEN
Title (fr)
PROCEDE DE PULVERISATION CATHODIQUE POUR PRODUIRE DES REVETEMENTS OPTIMISES VIS-A-VIS DES CONTRAINTES RESIDUELLES
Publication
Application
Priority
- DE 10222909 A 20020522
- EP 0304572 W 20030430
Abstract (en)
[origin: US2007009670A9] The invention relates to a method or a device for the production of especially natural voltage optimized coatings, especially low tensile stress coatings, by means of sputter processes, wherein a bipolar voltage shape is produced on the target (cathode). The positive voltage pulse is adjusted on the target in such a way that a bias voltage on the substrate is thus replaced.
IPC 8 full level
C23C 14/34 (2006.01); H01J 37/34 (2006.01)
CPC (source: EP US)
C23C 14/34 (2013.01 - EP US); H01J 37/34 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 03097896 A1 20031127; AT E481511 T1 20101015; AU 2003232242 A1 20031202; CN 100577855 C 20100106; CN 1656244 A 20050817; DE 10222909 A1 20031204; DE 50313095 D1 20101028; EP 1511877 A1 20050309; EP 1511877 B1 20100915; JP 2005534803 A 20051117; TW 200406500 A 20040501; TW I275655 B 20070311; US 2005233089 A1 20051020; US 2007009670 A9 20070111
DOCDB simple family (application)
EP 0304572 W 20030430; AT 03752719 T 20030430; AU 2003232242 A 20030430; CN 03811588 A 20030430; DE 10222909 A 20020522; DE 50313095 T 20030430; EP 03752719 A 20030430; JP 2004505408 A 20030430; TW 92113899 A 20030522; US 51579205 A 20050627