EP 1515923 A1 20050323 - METHOD FOR REDUCING AND CONTROLLING HEXAFLUOROSILICATE CONCENTRATION DURING THE POLISHING OF GLASS OBJECTS IN A POLISHING BATH CONTAINING SULPHURIC ACID AND HYDROFLUORIC ACID
Title (en)
METHOD FOR REDUCING AND CONTROLLING HEXAFLUOROSILICATE CONCENTRATION DURING THE POLISHING OF GLASS OBJECTS IN A POLISHING BATH CONTAINING SULPHURIC ACID AND HYDROFLUORIC ACID
Title (de)
VERFAHREN ZUR VERMINDERUNG UND KONTROLLE DER HEXAFLUOROSILICAT-KONZENTRATION BEIM POLIEREN VON GLASGEGENSTÄNDEN IN EINEM SCHWEFELSÄURE UND FLUSSSÄURE ENTHALTENDEN POLIERBAD
Title (fr)
PROCEDE PERMETTANT DE REDUIRE ET DE SURVEILLER LA CONCENTRATION EN HEXAFLUOROSILICATE LORS DU POLISSAGE D'OBJETS EN VERRE DANS UN BAIN DE POLISSAGE CONTENANT DE L'ACIDE SULFURIQUE AINSI QUE DE L'ACIDE FLUORHYDRIQUE
Publication
Application
Priority
- DE 10228116 A 20020624
- EP 0306487 W 20030618
Abstract (en)
[origin: WO2004000747A1] The invention relates to a method for reducing and controlling the concentration of hexafluorosilicate ions arising when glass objects are polished in a polishing bath containing sulphuric acid and hydrofluoric acid. Potassium floride, potassium sulphate, sodium fluoride, sodium sulphate or aluminium sulphate is added to the polishing bath or sulphuric acid rinsing bath in quantities such that a drop in the concentration of fluoride ions below the optimum working range is avoided.
IPC 1-7
IPC 8 full level
C03C 15/00 (2006.01); C03C 15/02 (2006.01)
CPC (source: EP US)
C03C 15/02 (2013.01 - EP US)
Citation (search report)
See references of WO 2004000747A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004000747 A1 20031231; AU 2003279390 A1 20040106; CN 1662464 A 20050831; DE 10228116 A1 20040129; EP 1515923 A1 20050323; JP 2005534595 A 20051117; US 2005230355 A1 20051020
DOCDB simple family (application)
EP 0306487 W 20030618; AU 2003279390 A 20030618; CN 03814763 A 20030618; DE 10228116 A 20020624; EP 03740288 A 20030618; JP 2004514796 A 20030618; US 51816204 A 20041214