Global Patent Index - EP 1518269 A1

EP 1518269 A1 20050330 - METHOD FOR CONTACTING PARTS OF A COMPONENT INTEGRATED INTO A SEMICONDUCTOR SUBSTRATE

Title (en)

METHOD FOR CONTACTING PARTS OF A COMPONENT INTEGRATED INTO A SEMICONDUCTOR SUBSTRATE

Title (de)

VERFAHREN ZUR HERSTELLUNG VON KONTAKTEN ZU TEILEN EINES IN EINEM HALBLEITERSUBSTRAT INTEGRIERTEN BAUELEMENTS

Title (fr)

PROCEDE DE PRODUCTION DE CONTACTS SUR LES ELEMENTS D UN COMP OSANT INTEGRE D UN SUBSTRAT DE SEMI-CONDUCTEUR

Publication

EP 1518269 A1 20050330 (DE)

Application

EP 03761426 A 20030624

Priority

  • DE 0302104 W 20030624
  • DE 10229188 A 20020628

Abstract (en)

[origin: WO2004003998A1] The invention relates to a method for contacting parts of a component integrated into a semiconductor substrate (1). According to the inventive method, a first contact hole is produced in an insulating layer (2), said contact hole being then filled with contact material (16) and connected to a line. The aim of the invention is to minimise the processes required for contacting parts of a component integrated into a semiconductor substrate. To this end, the hard mask (3) used to produce the contact hole is also used to structure the line.

IPC 1-7

H01L 21/768

IPC 8 full level

H01L 21/768 (2006.01)

CPC (source: EP US)

H01L 21/76804 (2013.01 - US); H01L 21/76808 (2013.01 - EP US); H01L 21/76897 (2013.01 - EP US)

Citation (search report)

See references of WO 2004003998A1

Designated contracting state (EPC)

DE

DOCDB simple family (publication)

WO 2004003998 A1 20040108; DE 10229188 A1 20040129; EP 1518269 A1 20050330; TW 200403734 A 20040301; TW I229375 B 20050311; US 2006094217 A1 20060504; US 7396749 B2 20080708

DOCDB simple family (application)

DE 0302104 W 20030624; DE 10229188 A 20020628; EP 03761426 A 20030624; TW 92117340 A 20030625; US 51974105 A 20051104