EP 1520063 A1 20050406 - BATH FOR GOLD ELECTRODEPOSITION
Title (en)
BATH FOR GOLD ELECTRODEPOSITION
Title (de)
BAD FÜR GALVANISCHEN GOLDNIEDERSCHLAG
Title (fr)
BAIN POUR DEPOT ELECTROLYTIQUE D'OR
Publication
Application
Priority
- EP 03729763 A 20030620
- CH 0300400 W 20030620
- EP 02405558 A 20020704
Abstract (en)
[origin: EP1378590A1] A bath for the electrolytic deposition of gold comprises, in solution in water, a gold sulfite, a grain refiner, an inhibitor and a conducting salt. The grain refiner is chosen from soluble compounds of bismuth, tin, tellurium and selenium. Preferred Features: The soluble bismuth compound is a soluble complex of ammonium citrate and bismuth. The inhibitor contains a derivative of phosphonic acid. The conducting salt is ammonium sulfite. The bath may also contain 20-100 g/liter, preferably 50 g/liter, of amidosulphonic acid.
IPC 1-7
IPC 8 full level
C25D 3/48 (2006.01)
CPC (source: EP)
C25D 3/48 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1378590 A1 20040107; AT E307918 T1 20051115; AU 2003240347 A1 20040123; DE 60302074 D1 20051201; DE 60302074 T2 20060713; EP 1520063 A1 20050406; EP 1520063 B1 20051026; ES 2252673 T3 20060516; WO 2004005589 A1 20040115
DOCDB simple family (application)
EP 02405558 A 20020704; AT 03729763 T 20030620; AU 2003240347 A 20030620; CH 0300400 W 20030620; DE 60302074 T 20030620; EP 03729763 A 20030620; ES 03729763 T 20030620