EP 1520295 A2 20050406 - METHOD FOR MAKING AN ANISOTROPIC CONDUCTIVE FILM WITH POINTED CONDUCTIVE INSERTS
Title (en)
METHOD FOR MAKING AN ANISOTROPIC CONDUCTIVE FILM WITH POINTED CONDUCTIVE INSERTS
Title (de)
HERSTELLUNGSVERFAHREN FÜR EINEN ANISOTROPISCHEN LEITERFILM MIT LEITENDEN EINSATZSTÜCKEN
Title (fr)
PROCEDE DE FABRICATION DE FILM CONDUCTEUR ANISOTROPE A INSERTS CONDUCTEURS POINTUS
Publication
Application
Priority
- FR 0302056 W 20030702
- FR 0208451 A 20020705
Abstract (en)
[origin: WO2004006324A2] The invention concerns a method for making an anisotropic conductive film with pointed conductive inserts. The method comprises engraving at least one pattern (C1, K1) in a monocrystalline substrate (15) to form at least one cell (22, 26) having a base designed to form the contour of one end of an insert (23, 27). The formation of the pattern is designed to reveal at least one tip projecting in the base of the cell during engraving of the pattern in a crystallographic plane (100) of the substrate with planes (111) or (110) limiting the pattern. The invention is applicable to microconnectics.
IPC 1-7
IPC 8 full level
H01L 21/48 (2006.01); H01L 21/60 (2006.01)
CPC (source: EP US)
H01L 21/486 (2013.01 - EP US); H01L 24/28 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 2224/29111 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/8319 (2013.01 - EP US); H01L 2224/838 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0132 (2013.01 - EP US); H01L 2924/0781 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US)
Citation (search report)
See references of WO 2004006324A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
FR 2842023 A1 20040109; FR 2842023 B1 20050930; EP 1520295 A2 20050406; US 2005233587 A1 20051020; WO 2004006324 A2 20040115; WO 2004006324 A3 20041209
DOCDB simple family (application)
FR 0208451 A 20020705; EP 03762727 A 20030702; FR 0302056 W 20030702; US 52033805 A 20050104