EP 1520321 A1 20050406 - MINIATURE RF AND MICROWAVE COMPONENTS AND METHODS FOR FABRICATING SUCH COMPONENTS
Title (en)
MINIATURE RF AND MICROWAVE COMPONENTS AND METHODS FOR FABRICATING SUCH COMPONENTS
Title (de)
MINIATURISIERTE RF- UND MIKROWELLENBAUELEMENTE UND ZUGEHÖRIGES HERSTELLUNGSVERFAHREN
Title (fr)
COMPOSANTS RF ET ELECTROMAGNETIQUES MINIATURES ET PROCEDES DE FABRICATION DESDITS COMPOSANTS
Publication
Application
Priority
- US 0320458 W 20030627
- US 39253102 P 20020627
- US 41537402 P 20021001
- US 30952102 A 20021203
- US 46450403 P 20030421
- US 43451903 A 20030507
- US 43449703 A 20030507
- US 43410303 A 20030507
- US 43429503 A 20030507
- US 47655403 P 20030606
Abstract (en)
[origin: WO2004004061A1] RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
IPC 1-7
IPC 8 full level
B81B 3/00 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01P 1/12 (2006.01); H01P 1/18 (2006.01); H01P 1/202 (2006.01); H01P 3/06 (2006.01); H01P 5/08 (2006.01); H01P 5/16 (2006.01); H01P 5/18 (2006.01); H01P 5/22 (2006.01); H01P 11/00 (2006.01); H01Q 11/10 (2006.01)
CPC (source: EP)
B81C 1/00126 (2013.01); C23C 18/1605 (2013.01); C23C 18/1651 (2013.01); C25D 1/003 (2013.01); H01P 1/202 (2013.01); H01P 3/06 (2013.01); H01P 5/183 (2013.01); H01P 11/00 (2013.01); H01P 11/005 (2013.01); B81B 2201/0292 (2013.01); B81C 2201/0109 (2013.01)
Citation (search report)
See references of WO 2004004061A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004004061 A1 20040108; AU 2003280468 A1 20040119; CN 1669177 A 20050914; EP 1520321 A1 20050406; JP 2005532015 A 20051020; JP 2009038806 A 20090219
DOCDB simple family (application)
US 0320458 W 20030627; AU 2003280468 A 20030627; CN 03817237 A 20030627; EP 03742306 A 20030627; JP 2004549838 A 20030627; JP 2008217229 A 20080826