EP 1522134 A2 20050413 - DYNAMOELECTRIC MACHINE HAVING AN ENCAPSULATED COIL STRUCTURE
Title (en)
DYNAMOELECTRIC MACHINE HAVING AN ENCAPSULATED COIL STRUCTURE
Title (de)
DYNAMOELEKTRISCHE MASCHINE MIT HARZVERKAPSELTER SPULENANORDNUNG
Title (fr)
MACHINE ELECTRODYNAMIQUE A ENROULEMENTS ENROBES
Publication
Application
Priority
- US 0321544 W 20030710
- US 39525102 P 20020712
Abstract (en)
[origin: WO2004008603A2] Magnet wires wound in slots in a lamination stack of a dynamoelectric machine are encapsulated, in whole or in par, with plastic. The plastic may be thermally conductive and have features molded therein that enhance heat transfer. The plastic may stiffen the armature and increase its critical speed. Characteristics of the plastic, its geometry and its distribution may be varied to adjust spinning inertia and resonant frequency of the armature. The magnet wires may be compressed into the slots, by application of iso-static pressure or by the pressure of the plastic being molded around them. Larger magnet wire can then be used which increases the power of the electric motor using the armature having the larger magnet wire. A two or three plate mold may be used to mold the plastic around the armature. Balancing features can be molded in place. The plastic can have a base polymer that is a blend of two or more polymers and various thermally conductive fillings.
IPC 1-7
H02K 15/12; H02K 13/00; H02K 3/34; H02K 1/32; H02K 9/22; H02K 3/46; H02K 3/48; H02K 3/12; H02K 1/30; H02K 15/16; H02K 7/04; H02K 13/04; H02K 3/30
IPC 8 full level
B29C 45/14 (2006.01); H01F 5/00 (2006.01); H02K 1/30 (2006.01); H02K 1/32 (2006.01); H02K 3/12 (2006.01); H02K 3/30 (2006.01); H02K 3/34 (2006.01); H02K 3/44 (2006.01); H02K 3/46 (2006.01); H02K 3/48 (2006.01); H02K 7/04 (2006.01); H02K 9/22 (2006.01); H02K 13/00 (2006.01); H02K 13/04 (2006.01); H02K 15/12 (2006.01); H02K 15/16 (2006.01); H02K 3/487 (2006.01); H02K 3/50 (2006.01); H02K 9/20 (2006.01)
CPC (source: EP US)
B29C 45/14639 (2013.01 - EP); H02K 1/30 (2013.01 - EP); H02K 1/32 (2013.01 - EP); H02K 3/12 (2013.01 - EP); H02K 3/30 (2013.01 - EP); H02K 3/345 (2013.01 - EP); H02K 3/46 (2013.01 - EP); H02K 3/48 (2013.01 - EP); H02K 7/04 (2013.01 - EP); H02K 9/223 (2021.01 - EP US); H02K 13/006 (2013.01 - EP); H02K 13/04 (2013.01 - EP); H02K 15/12 (2013.01 - EP); H02K 15/165 (2013.01 - EP); H02K 3/487 (2013.01 - EP); H02K 3/50 (2013.01 - EP); H02K 9/20 (2013.01 - EP US); H02K 9/227 (2021.01 - EP US)
Citation (search report)
See references of WO 2004008603A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
WO 2004008603 A2 20040122; WO 2004008603 A3 20040701; AU 2003251832 A1 20040202; AU 2003251832 A8 20040202; BR 0312291 A 20050412; CA 2486453 A1 20040122; CN 101017997 A 20070815; CN 101017997 B 20101013; CN 1669203 A 20050914; EP 1522134 A2 20050413; JP 2005533475 A 20051104; MX PA05000501 A 20050323
DOCDB simple family (application)
US 0321544 W 20030710; AU 2003251832 A 20030710; BR 0312291 A 20030710; CA 2486453 A 20030710; CN 03816618 A 20030710; CN 200610171993 A 20030710; EP 03764427 A 20030710; JP 2004521605 A 20030710; MX PA05000501 A 20030710