EP 1522567 A4 20051116 - COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID
Title (en)
COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID
Title (de)
ZUSAMMENSETZUNG UND VERFAHREN ZUR VORÜBERGEHENDEN BEFESTIGUNG EINES FESTKÖRPERS
Title (fr)
COMPOSITION ET PROCEDE POUR LA FIXATION TERMPORAIRE DE SOLIDES
Publication
Application
Priority
- JP 0305899 W 20030512
- JP 2002136995 A 20020513
- JP 2002157059 A 20020530
- JP 2002157060 A 20020530
- JP 2002235607 A 20020813
- JP 2002282307 A 20020927
- JP 2003059542 A 20030306
- JP 2003061792 A 20030307
- JP 2003061793 A 20030307
Abstract (en)
[origin: US2006275939A1] The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
IPC 1-7
C09J 11/00; C09J 201/00; C09J 5/00; C09J 7/00; H01L 21/304; H01L 21/301
IPC 8 full level
B24B 37/04 (2012.01); B24B 45/00 (2006.01)
CPC (source: EP KR US)
B24B 37/042 (2013.01 - EP US); B24B 37/30 (2013.01 - EP US); C09J 5/00 (2013.01 - KR); C09J 11/00 (2013.01 - KR); H01L 21/6835 (2013.01 - EP US); C09K 2323/05 (2020.08 - EP US); H01L 2221/68327 (2013.01 - EP US); H01L 2221/6834 (2013.01 - EP US)
Citation (search report)
- [X] US 5766509 A 19980616 - KAWATA YASUSHI [JP], et al
- [X] DE 3907261 A1 19900913 - NEMATEL DR RUDOLF EIDENSCHINK [DE]
- See references of WO 03095579A1
Designated contracting state (EPC)
AT BE BG CH CY DE FR GB IT LI NL
DOCDB simple family (publication)
US 2006275939 A1 20061207; AU 2003234794 A1 20031111; EP 1522567 A1 20050413; EP 1522567 A4 20051116; KR 20050006120 A 20050115; TW 200409227 A 20040601; TW I277148 B 20070321; US 2004185187 A1 20040923; US 7186448 B2 20070306; WO 03095579 A1 20031120
DOCDB simple family (application)
US 50171306 A 20060810; AU 2003234794 A 20030512; EP 03728056 A 20030512; JP 0305899 W 20030512; KR 20047000283 A 20030512; TW 92112840 A 20030512; US 48317804 A 20040109