EP 1523229 A2 20050413 - Semiconductor exercising apparatus, test socket apparatus and method of making thereof
Title (en)
Semiconductor exercising apparatus, test socket apparatus and method of making thereof
Title (de)
Halbleiter-Prüfvorrichtung, Prüfsockelvorrichtung und Verfahren zur Herstellung
Title (fr)
Appareil pour fiabiliser par rodage des semiconducteurs, connecteur pour tester et methode de fabrication
Publication
Application
Priority
- EP 99933638 A 19990630
- US 10816398 A 19980630
- US 20550298 A 19981204
Abstract (en)
Products and assemblies are provided for socketably receiving elongate interconnection elements (516), such as spring contact elements, extending from electronic components (518), such as semiconductor devices. Socket substrates (504) are provided with capture pads (506) for receiving ends of elongate interconnection elements (516) extending from electronic components (518). Various capture pad configurations are disclosed. A securing device such as a housing (520) positions the electronic component securely to the socket substrate (504). Connections to external devices are provided via conductive traces (510) adjacent the surface of the socket substrate. The socket substrate (504) may be supported by a support substrate (502). In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board. <IMAGE>
IPC 1-7
IPC 8 full level
B65D 85/86 (2006.01); G01R 1/04 (2006.01); G01R 31/00 (2006.01); G01R 31/26 (2006.01); G01R 31/28 (2006.01); H01L 21/673 (2006.01); H01L 23/04 (2006.01); H01L 23/13 (2006.01); H01L 23/32 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H05K 3/32 (2006.01); G01R 31/01 (2020.01)
CPC (source: EP KR US)
G01R 1/0408 (2013.01 - EP US); G01R 1/0433 (2013.01 - EP US); G01R 1/0466 (2013.01 - EP US); G01R 31/2863 (2013.01 - EP US); G01R 31/2867 (2013.01 - EP US); H01L 21/67294 (2013.01 - EP US); H01L 23/04 (2013.01 - EP US); H01L 23/13 (2013.01 - EP US); H01L 23/32 (2013.01 - EP US); H01L 23/5385 (2013.01 - EP US); H01L 23/544 (2013.01 - EP US); H01L 24/72 (2013.01 - EP US); H05K 3/32 (2013.01 - KR); H05K 3/325 (2013.01 - EP US); G01R 31/01 (2013.01 - EP US); G01R 31/2893 (2013.01 - EP US); H01L 2223/54473 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/73251 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H05K 2201/09472 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
US 6644982 B1 20031111; DE 69938607 D1 20080605; DE 69938607 T2 20090610; EP 1523229 A2 20050413; EP 1523229 A3 20050727; EP 1523229 B1 20071024; KR 100429755 B1 20040503; KR 100431916 B1 20040517; KR 20010053283 A 20010625; KR 20010080672 A 20010822; KR 20010081065 A 20010825; MY 122343 A 20060429; US 2002025603 A1 20020228; US 2005164416 A1 20050728; US 2007269909 A1 20071122; US 6627483 B2 20030930; US 6887723 B1 20050503; US 7217580 B2 20070515
DOCDB simple family (application)
US 26046699 A 19990301; DE 69938607 T 19991203; EP 04025133 A 19990630; KR 20007014998 A 20001229; KR 20017006935 A 20010602; KR 20017006945 A 20010602; MY PI9905292 A 19991206; US 26079499 A 19990301; US 26079599 A 19990301; US 74908407 A 20070515; US 97370404 A 20041026