EP 1523684 A1 20050420 - FIDUCIAL ALIGNMENT MARKS ON MICROELECTRONIC SPRING CONTACTS
Title (en)
FIDUCIAL ALIGNMENT MARKS ON MICROELECTRONIC SPRING CONTACTS
Title (de)
JUSTIERMARKEN AUF MIKROELEKTRONISCHEN FEDERKONTAKTEN
Title (fr)
MARQUES D'ALIGNEMENT DE REPERE SUR DES CONTACTS A RESSORT MICRO-ELECTRONIQUES
Publication
Application
Priority
US 0222477 W 20020715
Abstract (en)
[origin: WO2004015432A1] Microelectronic spring contacts with fiducial alignment marks for use on a semiconductor wafer contactor or similar apparatus, and methods for making such marks by using a sacrificial substrate, are disclosed. Each alignment mark is placed on a pad adjacent to a contact tip. The alignment mark is positioned on the pad so that it will not contact the terminal or any other part of a wafer under test. The alignment mark and the contact tip are preferably positioned on the pad in the same lithographic step. Then, the pad and like pads, selected ondes of which also have similar alignment marks, are attached to the ends of an array of resilient contact elements. A plurality of alignment marks accurately positioned in relation to a plurality of contact tips on a contactor is thus disclosed. Configurations for ensuring that the alignment marks remain free of debris and easily located for essentially the entire life of the contactare disclosed, as are various different exemplary shapes of alignment marks.
IPC 1-7
IPC 8 full level
G01R 1/06 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01)
CPC (source: EP KR)
G01R 1/06738 (2013.01 - EP); G01R 1/06794 (2013.01 - EP); H01L 22/00 (2013.01 - KR); H01L 23/544 (2013.01 - EP); G01R 1/06727 (2013.01 - EP); G01R 1/07307 (2013.01 - EP); H01L 2223/54426 (2013.01 - EP); H01L 2223/54473 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP)
Citation (search report)
See references of WO 2004015432A1
Citation (examination)
- US 6566149 B1 20030520 - KANAMARU MASATOSHI [JP], et al
- US 2007045874 A1 20070301 - ELDRIDGE BENJAMIN N [US], et al
- WO 0016107 A1 20000323 - HITACHI LTD [JP], et al
Designated contracting state (EPC)
DE FR IE IT
DOCDB simple family (publication)
WO 2004015432 A1 20040219; AU 2002368160 A1 20040225; CN 100447573 C 20081231; CN 1668928 A 20050914; EP 1523684 A1 20050420; JP 2005533263 A 20051104; KR 100880088 B1 20090123; KR 20050019870 A 20050303
DOCDB simple family (application)
US 0222477 W 20020715; AU 2002368160 A 20020715; CN 02829591 A 20020715; EP 02752348 A 20020715; JP 2004527495 A 20020715; KR 20057000689 A 20050114