EP 1523748 A1 20050420 - INDUCTIVE COMPONENT AND USE OF SAID COMPONENT
Title (en)
INDUCTIVE COMPONENT AND USE OF SAID COMPONENT
Title (de)
INDUKTIVES BAUELEMENT UND VERWENDUNG DES BAUELEMENTS
Title (fr)
COMPOSANT INDUCTIF ET UTILISATION DE CELUI-CI
Publication
Application
Priority
- DE 0302447 W 20030721
- DE 10232952 A 20020719
Abstract (en)
[origin: WO2004017338A1] The invention relates to an inductive component (1), for the formation of a magnetic circuit, comprising at least one wire winding (3) and at least one core (4) with a ferromagnetic core material. Said core comprises a gap (7, 8) and at least one further gap (8, 7) to interrupt the magnetic circuit. The inductive component is characterised in that the gaps each have a gap width of at least 1.0mm. The core comprises two pieces, for example, which are arranged opposed to each other across the gaps (7, 8) and separated from each other by the gap width. The component is advantageously symmetrical with an essentially equal gap width for the gaps. A miniaturised inductive component is possible by the use of a hire winding made from high frequency braided wire and core material capable of accepting high frequencies, which has a high Q-factor even on a high power throughput and thus low electrical losses. In order to increase the Q-factor, the inductive component also has a cooling device for cooling the wire winding. The device is thus provided with a composite material with a thermally-conducting filler. The inductive component is used in a so-called electronic ballast (EVG) in the field of illumination.
IPC 1-7
IPC 8 full level
H01F 3/14 (2006.01); H01F 17/04 (2006.01); H01F 27/02 (2006.01); H01F 27/22 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 30/00 (2006.01); H01F 37/00 (2006.01); H01F 27/32 (2006.01)
CPC (source: EP US)
H01F 3/14 (2013.01 - EP US); H01F 17/043 (2013.01 - EP US); H01F 27/022 (2013.01 - EP US); H01F 27/22 (2013.01 - EP US); H01F 27/327 (2013.01 - EP US)
Citation (search report)
See references of WO 2004017338A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 2004017338 A1 20040226; AU 2003250792 A1 20040303; AU 2003250792 B2 20070215; CN 100538924 C 20090909; CN 1669097 A 20050914; DE 50309696 D1 20080605; EP 1523748 A1 20050420; EP 1523748 B1 20080423; JP 2005537636 A 20051208; US 2005206487 A1 20050922; US 7508290 B2 20090324
DOCDB simple family (application)
DE 0302447 W 20030721; AU 2003250792 A 20030721; CN 03817261 A 20030721; DE 50309696 T 20030721; EP 03787700 A 20030721; JP 2004528405 A 20030721; US 52174205 A 20050510