Global Patent Index - EP 1523769 A1

EP 1523769 A1 20050420 - ASSEMBLY COMPRISING A SEMICONDUCTOR CHIP AND SUPPORT THEREFOR, IN ADDITION TO METHOD FOR A BONDED WIRING CONNECTION

Title (en)

ASSEMBLY COMPRISING A SEMICONDUCTOR CHIP AND SUPPORT THEREFOR, IN ADDITION TO METHOD FOR A BONDED WIRING CONNECTION

Title (de)

ANORDNUNG MIT EINEM HALBLEITERCHIP UND DESSEN TRÄGER SOWIE VERFAHREN ZUR BOND-DRAHTVERBINDUNG

Title (fr)

CIRCUIT COMPRENANT UNE PUCE SEMI-CONDUCTRICE ET SON SUPPORT ET PROCEDE DE LIAISON PAR FIL DE CONNEXION

Publication

EP 1523769 A1 20050420 (DE)

Application

EP 03787714 A 20030722

Priority

  • DE 0302465 W 20030722
  • DE 10233607 A 20020724

Abstract (en)

[origin: DE10233607A1] A semiconductor chip (3) is connected to a carrier (1) by a wire (6) which has nail head end contacts (4,5). The carrier has a wedge contact (7) to the wire nail head and forms a through connection (9). An Independent claim is also included for a process for electrically connecting a chip and carrier as above.

IPC 1-7

H01L 21/607; H01L 23/498; H01L 21/48

IPC 8 full level

H01L 21/48 (2006.01); H01L 21/607 (2006.01); H01L 23/498 (2006.01)

CPC (source: EP US)

H01L 21/486 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H05K 3/328 (2013.01 - EP US); H05K 3/4015 (2013.01 - EP US); H01L 24/45 (2013.01 - EP US); H01L 24/78 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2224/48095 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48235 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/4848 (2013.01 - EP US); H01L 2224/48599 (2013.01 - EP US); H01L 2224/48699 (2013.01 - EP US); H01L 2224/78301 (2013.01 - EP US); H01L 2224/85051 (2013.01 - EP US); H01L 2224/85181 (2013.01 - EP US); H01L 2224/85205 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H05K 1/113 (2013.01 - EP US); H05K 2203/049 (2013.01 - EP US)

C-Set (source: EP US)

EP

  1. H01L 2224/45124 + H01L 2924/00014
  2. H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
  3. H01L 2224/85205 + H01L 2224/48465 + H01L 2924/00
  4. H01L 2224/48465 + H01L 2224/48095 + H01L 2924/00
  5. H01L 2224/45144 + H01L 2924/00015
  6. H01L 2224/45124 + H01L 2924/00015
  7. H01L 2924/00014 + H01L 2224/85399
  8. H01L 2924/00014 + H01L 2224/05599
  9. H01L 2224/45144 + H01L 2924/00014
  10. H01L 2224/48095 + H01L 2924/00014
  11. H01L 2224/4848 + H01L 2224/48465
  12. H01L 2224/78301 + H01L 2924/00014
  13. H01L 2224/85181 + H01L 2224/48465
  14. H01L 2224/48465 + H01L 2224/48227
  15. H01L 2224/48465 + H01L 2224/48227 + H01L 2924/00
  16. H01L 2224/85205 + H01L 2224/45144 + H01L 2924/00

US

  1. H01L 2224/45124 + H01L 2924/00014
  2. H01L 2224/85205 + H01L 2224/45124 + H01L 2924/00
  3. H01L 2224/85205 + H01L 2224/48465 + H01L 2924/00
  4. H01L 2224/48465 + H01L 2224/48095 + H01L 2924/00
  5. H01L 2224/45144 + H01L 2924/00015
  6. H01L 2224/45124 + H01L 2924/00015
  7. H01L 2224/45144 + H01L 2924/00014
  8. H01L 2224/48095 + H01L 2924/00014
  9. H01L 2224/4848 + H01L 2224/48465
  10. H01L 2224/78301 + H01L 2924/00014
  11. H01L 2224/85181 + H01L 2224/48465
  12. H01L 2224/48465 + H01L 2224/48227
  13. H01L 2224/48465 + H01L 2224/48227 + H01L 2924/00
  14. H01L 2224/85205 + H01L 2224/45144 + H01L 2924/00

Citation (search report)

See references of WO 2004017400A1

Designated contracting state (EPC)

FR IT

DOCDB simple family (publication)

DE 10233607 A1 20040212; DE 10233607 B4 20050929; AU 2003258458 A1 20040303; EP 1523769 A1 20050420; JP 2006502564 A 20060119; JP 4308765 B2 20090805; US 2005127497 A1 20050616; US 7053489 B2 20060530; WO 2004017400 A1 20040226

DOCDB simple family (application)

DE 10233607 A 20020724; AU 2003258458 A 20030722; DE 0302465 W 20030722; EP 03787714 A 20030722; JP 2004528420 A 20030722; US 3928405 A 20050120