EP 1524338 A1 20050420 - PLATING DEVICE
Title (en)
PLATING DEVICE
Title (de)
ABSCHEIDUNGSVERFAHREN
Title (fr)
DISPOSITIF D'ELECTRODEPOSITION
Publication
Application
Priority
- JP 0309144 W 20030718
- JP 2002210097 A 20020718
Abstract (en)
A plating apparatus according to the present invention has a plating tank (40) for holding a plating solution (10), an anode (56) disposed so as to be immersed in the plating solution (10) in the plating tank (40), a regulation plate (60) disposed between the anode (56) and a plating workpiece (W) disposed so as to face the anode (56), and a plating power supply (24) for supply a current between the anode (56) and the plating workpiece (W) to carry out plating. The regulation plate (60) is disposed so as to separate the plating solution (10) held in the plating tank (40) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group (68) having a large number of through-holes (66) is formed in the regulation plate (60). <IMAGE>
IPC 1-7
IPC 8 full level
C25D 7/12 (2006.01); C25D 17/00 (2006.01); C25D 21/12 (2006.01)
CPC (source: EP KR US)
C25D 7/123 (2013.01 - EP US); C25D 17/001 (2013.01 - EP US); C25D 17/002 (2013.01 - EP US); C25D 17/008 (2013.01 - EP US); C25D 21/12 (2013.01 - EP KR US)
Designated contracting state (EPC)
AT BE BG DE FR GB
DOCDB simple family (publication)
US 2004262150 A1 20041230; CN 100439571 C 20081203; CN 101387004 A 20090318; CN 101387004 B 20101215; CN 1610769 A 20050427; EP 1524338 A1 20050420; EP 1524338 A4 20080227; JP 4434948 B2 20100317; JP WO2004009879 A1 20051117; KR 101027489 B1 20110406; KR 20050025114 A 20050311; KR 20100052577 A 20100519; US 2009218231 A1 20090903; WO 2004009879 A1 20040129
DOCDB simple family (application)
US 48535004 A 20040819; CN 03801815 A 20030718; CN 200810170023 A 20030718; EP 03765327 A 20030718; JP 0309144 W 20030718; JP 2004522759 A 20030718; KR 20047001692 A 20030718; KR 20107010317 A 20030718; US 45334709 A 20090507