EP 1525069 A4 20060524 - SYSTEM AND METHOD OF LASER DRILLING USING A CONTINUOUSLY OPTIMIZED DEPTH OF FOCUS
Title (en)
SYSTEM AND METHOD OF LASER DRILLING USING A CONTINUOUSLY OPTIMIZED DEPTH OF FOCUS
Title (de)
LASERBOHRSYSTEM UND -VERFAHREN UNTER VERWENDUNG EINER KONTINUIERLICH OPTIMIERTEN SCHÄRFENTIEFE
Title (fr)
SYSTEME ET PROCEDE DE PERCAGE LASER AU MOYEN D'UNE PROFONDEUR DE FOYER OPTIMISEE
Publication
Application
Priority
- US 0305909 W 20030226
- US 39846902 P 20020725
- US 26699902 A 20021008
IPC 8 full level
B23K 26/38 (2006.01); B23K 26/02 (2006.01); B23K 26/06 (2006.01); B23K 26/08 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP)
B23K 26/02 (2013.01); B23K 26/035 (2015.10); B23K 26/0624 (2015.10); B23K 26/0861 (2013.01); B23K 26/382 (2015.10); B23K 26/389 (2015.10); B23K 2103/50 (2018.07); H05K 3/0026 (2013.01)
Citation (search report)
- [XPAP] WO 03004210 A1 20030116 - VIRTEK LASER SYSTEMS INC [CA]
- [XY] US 4689467 A 19870825 - INOUE KIYOSHI [JP]
- [XA] US 5063280 A 19911105 - INAGAWA HIDEHO [JP], et al
- [A] WO 9719217 A2 19970529 - UNIV LOUGHBOROUGH [GB], et al
- [Y] PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03)
- [XA] PATENT ABSTRACTS OF JAPAN vol. 017, no. 645 (M - 1517) 30 November 1993 (1993-11-30)
- [X] PATENT ABSTRACTS OF JAPAN vol. 012, no. 424 (M - 761) 10 November 1988 (1988-11-10)
- See references of WO 2004011187A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
AT E428531 T1 20090515; AU 2003212424 A1 20040216; CN 1313239 C 20070502; CN 1658997 A 20050824; DE 60327206 D1 20090528; EP 1525069 A1 20050427; EP 1525069 A4 20060524; EP 1525069 B1 20090415; JP 2006503713 A 20060202
DOCDB simple family (application)
AT 03709364 T 20030226; AU 2003212424 A 20030226; CN 03812690 A 20030226; DE 60327206 T 20030226; EP 03709364 A 20030226; JP 2005505592 A 20030226