EP 1525619 A1 20050427 - SURFACE-MOUNTED SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
SURFACE-MOUNTED SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
OBERFLÄCHENMONTIERBARES HALBLEITERBAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
COMPOSANT A SEMICONDUCTEUR POUR MONTAGE EN SURFACE ET PROCEDE DE FABRICATION
Publication
Application
Priority
- DE 0302259 W 20030707
- DE 10234978 A 20020731
- DE 10244888 A 20020926
Abstract (en)
[origin: WO2004017407A1] Disclosed is a surface-mounted semiconductor component comprising a semiconductor chip (1), at least two external electrical connections (3, 4) that are connected in an electrically conducting manner to at least two electrical contacts of the semiconductor chip (1), and a chip cover (5). The two external electrical connections (3, 4) are disposed on a film (2) having a thickness of no more than 100 ñm. The semiconductor chip (1) is fixed to a first main surface (22) of the film (2) while the chip cover (5) is applied to said first main surface (22). Also disclosed is a method for producing such a component.
IPC 1-7
IPC 8 full level
H01L 23/12 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC (source: EP US)
H01L 21/561 (2013.01 - EP US); H01L 21/565 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 23/49838 (2013.01 - EP US); H01L 23/4985 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 33/486 (2013.01 - EP US); H01L 33/62 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01084 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/12043 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 2004017407A1
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
WO 2004017407 A1 20040226; CN 1672260 A 20050921; EP 1525619 A1 20050427; JP 2005535144 A 20051117; TW 200406071 A 20040416; TW I227569 B 20050201; US 2005212098 A1 20050929; US 2007184629 A1 20070809; US 7199470 B2 20070403; US 7488622 B2 20090210
DOCDB simple family (application)
DE 0302259 W 20030707; CN 03818408 A 20030707; EP 03787632 A 20030707; JP 2004528349 A 20030707; TW 92120211 A 20030724; US 5271205 A 20050131; US 73191107 A 20070402