EP 1526192 A1 20050427 - Electrolytic process for depositing a graded layer on a substrate and component
Title (en)
Electrolytic process for depositing a graded layer on a substrate and component
Title (de)
Elektrolytisches Verfahren zum Abscheiden einer gradierten Schicht auf ein Substrat und Bauteil
Title (fr)
Procédé électrolytique pour la déposition d'une couche graduelle sur un substrat et composant
Publication
Application
Priority
EP 03024373 A 20031024
Abstract (en)
The electroplating process, to deposit a coating on a substrate (13) or component, gives a graduated coating layer by altering the composition of the electrolyte (7) at timed intervals. The electrolyte within the bath (4), has at least two components (28,31), with an additional feed of the second component (31) in time intervals (t) to alter the electrolyte composition, or the first component (28) is taken out at least partially. The first component is a metal, especially an alloy, or a ceramic; and the second component is metallic. The electrolyte is agitated mechanically. The current/voltage pulses (40) are rectangular or triangular.
Abstract (de)
Bisherige elektrolytische Abscheidungsverfahren können gradierte Schichten nur schlecht aus den Bestandteilen auf ein Substrat abscheiden. Das erfindungsgemäße Verfahren ermöglicht das elektrolytische Abscheiden einer gradierten Schicht auf ein Substrat (13) durch zeitliche Variierung der Zusammensetzung des Elektrolyten (7). <IMAGE>
IPC 1-7
IPC 8 full level
C25D 5/00 (2006.01); C25D 5/10 (2006.01); C25D 5/18 (2006.01); C25D 5/20 (2006.01); C25D 15/02 (2006.01); F01D 5/00 (2006.01); F01D 5/28 (2006.01)
CPC (source: EP US)
C25D 5/10 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 5/20 (2013.01 - EP US); C25D 15/02 (2013.01 - EP US); C25D 21/14 (2013.01 - EP US); F01D 5/005 (2013.01 - EP US); F01D 5/288 (2013.01 - EP US); Y10T 428/31 (2015.01 - EP US)
Citation (search report)
- [Y] EP 0443877 A1 19910828 - BAJ LTD [GB]
- [Y] EP 0368753 A1 19900516 - SNECMA [FR]
- [Y] GB 2167446 A 19860529 - BAJ LTD, et al
- [X] EFIMOV E A ET AL: "CODEPOSITION OF COBALT WITH CHROMIUM", SURFACE TREATMENT TECHNOLOGY ABSTRACTS, FINISHING PUBLICATIONS LTD. TEDDINGTON, GB, vol. 35, no. 6, 1 November 1993 (1993-11-01), pages 337, XP000445193, ISSN: 0950-5199
- [YX] JUN L ET AL: "MICROSTRUCTURE CHARACTERISTICS OF THE NICKEL MATRIX IN ELECTRODEPOSITED NI-PSZ GRADIENT COATING", TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, INSTITUTE OF METAL FINISHING. LONDON, GB, VOL. 76, NR. PART 4, PAGE(S) 131-134, ISSN: 0020-2967, XP000765554
- [YX] DONA J M ET AL: "CHEMICAL BATH CODEPOSITED CDS-ZNS FILM CHARACTERIZATION", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 268, no. 1/2, 1 November 1995 (1995-11-01), pages 5 - 12, XP000623600, ISSN: 0040-6090
- [YX] RAMASWAMY R ET AL: "OCCLUSION PLATING OF NICKEL-TALC COMPOSITES", METAL FINISHING, ELSEVIER SCIENCE PUBLISHING, NEW YORK, NY, US, vol. 90, no. 9, 1 September 1992 (1992-09-01), pages 23 - 26, XP000329877, ISSN: 0026-0576
Designated contracting state (EPC)
CH DE GB IT LI
DOCDB simple family (publication)
DOCDB simple family (application)
EP 03024373 A 20031024; US 97231004 A 20041022