EP 1527215 A2 20050504 - APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE
Title (en)
APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE
Title (de)
VORRICHTUNG UND VERFAHREN ZUR ELEKTROPLATTIERUNG EINER WAFEROBERFLÄCHE
Title (fr)
APPAREIL ET PROCEDE DE GALVANOPLASTIE D'UNE SURFACE DE PLAQUETTE
Publication
Application
Priority
- EP 02805861 A 20021212
- EP 01205083 A 20011224
- IB 0205396 W 20021212
Abstract (en)
[origin: WO03056609A2] The present invention provides for a method of electroplating a wafer surface comprising introducing a plating liquid to the wafer surface in a chamber and rotating the wafer about an axis of rotation passing through the surface to be plated, and including the further step of moving the wafer such that its axis of rotation is itself caused to rotate about a second axis of rotation.
IPC 1-7
IPC 8 full level
C25D 21/10 (2006.01); C25D 5/00 (2006.01); C25D 7/12 (2006.01); H01L 21/00 (2006.01); H01L 21/288 (2006.01); C25D 5/04 (2006.01); C25D 17/06 (2006.01)
CPC (source: EP US)
C25D 5/08 (2013.01 - EP US); C25D 17/001 (2013.01 - EP US); H01L 21/6715 (2013.01 - EP US); C25D 5/04 (2013.01 - EP US); C25D 17/06 (2013.01 - EP US); C25D 21/10 (2013.01 - EP US)
Citation (search report)
See references of WO 03056609A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
WO 03056609 A2 20030710; WO 03056609 A3 20050310; AU 2002367224 A1 20030715; AU 2002367224 A8 20030715; CN 1630739 A 20050622; EP 1527215 A2 20050504; JP 2005520930 A 20050714; TW 200411089 A 20040701; US 2005072680 A1 20050407
DOCDB simple family (application)
IB 0205396 W 20021212; AU 2002367224 A 20021212; CN 02825978 A 20021212; EP 02805861 A 20021212; JP 2003557031 A 20021212; TW 91136661 A 20021219; US 49927004 A 20040618