Global Patent Index - EP 1527240 A1

EP 1527240 A1 20050504 - Process for manufacturing interconnectable building parts and set of building parts with connecting elements

Title (en)

Process for manufacturing interconnectable building parts and set of building parts with connecting elements

Title (de)

Verfahren zur Herstellung von miteinander verbindbaren Bauteilen sowie Anordnung von Bauteilen mit Verbindungselementen

Title (fr)

Procédé de fabrication de pièces interconnectables et ensemble de pièces avec des éléments de connexion

Publication

EP 1527240 A1 20050504 (DE)

Application

EP 03732391 A 20030516

Priority

  • DE 10233731 A 20020724
  • EP 0305139 W 20030516

Abstract (en)

[origin: US2004016197A1] An arrangement of building elements capable of a snap-fastening interconnection comprises an element, especially the tongue, consisting of a different material from the other building elements. An MDF/HDF panel, is initially milled along the longitudinal and/or transverse sides, and the resulting groove is then provided and/or foam-filled with extrudates. Finally, the free ends of the extrudates are milled to form the profile of the tongue. Alternatively, or additionally, a groove may also be milled into the extrudates.

IPC 1-7

E04F 15/02; E04F 15/04

IPC 8 full level

E04F 15/02 (2006.01); E04F 15/04 (2006.01)

CPC (source: EP US)

E04F 15/02 (2013.01 - EP US); E04F 15/02011 (2013.01 - EP US); E04F 15/02016 (2013.01 - EP US); E04F 15/04 (2013.01 - EP US); E04F 2201/0115 (2013.01 - EP US); E04F 2201/049 (2013.01 - EP US); E04F 2201/0529 (2013.01 - EP US)

Citation (search report)

See references of WO 2004015221A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

Designated extension state (EPC)

AL LT LV MK

DOCDB simple family (publication)

US 2004016197 A1 20040129; US 7377081 B2 20080527; AT E399913 T1 20080715; AU 2003240255 A1 20040225; AU 2003240255 B2 20090108; CA 2493579 A1 20040219; CA 2493579 C 20101005; CN 100351480 C 20071128; CN 1671931 A 20050921; DE 10233731 A1 20040408; DE 50310075 D1 20080814; DK 1527240 T3 20081020; EP 1527240 A1 20050504; EP 1527240 B1 20080702; ES 2305464 T3 20081101; PT 1527240 E 20080905; SI 1527240 T1 20081231; WO 2004015221 A1 20040219

DOCDB simple family (application)

US 44645603 A 20030528; AT 03732391 T 20030516; AU 2003240255 A 20030516; CA 2493579 A 20030516; CN 03817381 A 20030516; DE 10233731 A 20020724; DE 50310075 T 20030516; DK 03732391 T 20030516; EP 0305139 W 20030516; EP 03732391 A 20030516; ES 03732391 T 20030516; PT 03732391 T 20030516; SI 200331361 T 20030516