EP 1528631 B1 20090218 - Solderless connection system for printed circuits
Title (en)
Solderless connection system for printed circuits
Title (de)
Lötfreies Verbindungssystem für Leiterplatten
Title (fr)
Système de connexion sans soudure pour cartes a circuits imprimés
Publication
Application
Priority
FR 0312561 A 20031027
Abstract (en)
[origin: EP1528631A1] The system has conducting contact units (24) projecting along a direction perpendicular to a plane of a printed circuit board (12), to be in electrical contact with corresponding conducting drop terminals (16) of an external circuit (14). The terminals have main segments coaxial with contact units, and folded end segments (44) contacting a clamp (30) to contact the contact units and being in a plane parallel to the board`s plane.
IPC 8 full level
H01R 12/16 (2006.01); H01R 12/22 (2006.01); H01R 12/71 (2011.01); H01R 13/11 (2006.01); H01R 13/115 (2006.01)
CPC (source: EP)
H01R 12/7076 (2013.01); H01R 13/112 (2013.01)
Designated contracting state (EPC)
DE ES GB IT SE
DOCDB simple family (publication)
EP 1528631 A1 20050504; EP 1528631 B1 20090218; DE 602004019486 D1 20090402; ES 2322150 T3 20090617; FR 2861505 A1 20050429; FR 2861505 B1 20100903
DOCDB simple family (application)
EP 04025391 A 20041026; DE 602004019486 T 20041026; ES 04025391 T 20041026; FR 0312561 A 20031027