EP 1530223 A4 20060628 - HIGH THERMAL CONDUCTIVITY INSULATING MEMBER AND ITS MANUFACTURING METHOD, ELECTROMAGNETIC COIL, AND ELECTROMAGNETIC DEVICE
Title (en)
HIGH THERMAL CONDUCTIVITY INSULATING MEMBER AND ITS MANUFACTURING METHOD, ELECTROMAGNETIC COIL, AND ELECTROMAGNETIC DEVICE
Title (de)
ISOLATIONSELEMENT MIT HOHER THERMISCHER LEITFÄHIGKEIT, VERFAHREN ZU DESSEN HERSTELLUNG, ELEKTROMAGNETISCHE SPULE UND ELEKTROMAGNETISCHE VORRICHTUNG
Title (fr)
ELEMENT ISOLANT A CONDUCTIVITE THERMIQUE ELEVEE ET SON PROCEDE DE FABRICATION, BOBINE ELECTROMAGNETIQUE ET DISPOSITIF ELECTROMAGNETIQUE
Publication
Application
Priority
- JP 0308564 W 20030704
- JP 2002196363 A 20020704
- JP 2003144919 A 20030522
Abstract (en)
[origin: EP1530223A1] The present invention provides a solution to the above-described drawbacks, and more specifically, as the tape-like or sheet-like insulation member, the resin matrix in which the first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, that are diffused in the resin matrix, and the second particles having a heat conductivity of 0.5 W/mK or higher and 300 W/mK or lower, are diffused, is employed. <IMAGE>
IPC 1-7
IPC 8 full level
H01F 27/22 (2006.01); H01F 41/12 (2006.01); H01F 5/06 (2006.01); H01F 27/32 (2006.01)
CPC (source: EP)
H01F 27/22 (2013.01); H01F 41/127 (2013.01); H01F 5/06 (2013.01); H01F 27/323 (2013.01); H01F 27/327 (2013.01)
Citation (search report)
- [A] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05)
- See references of WO 2004006271A1
Designated contracting state (EPC)
CH DE FR LI
DOCDB simple family (publication)
EP 1530223 A1 20050511; EP 1530223 A4 20060628; EP 1530223 B1 20090204; CN 1324615 C 20070704; CN 1666303 A 20050907; DE 60326072 D1 20090319; WO 2004006271 A1 20040115
DOCDB simple family (application)
EP 03741216 A 20030704; CN 03815770 A 20030704; DE 60326072 T 20030704; JP 0308564 W 20030704