EP 1530654 A2 20050518 - METHOD FOR ELECTROPLATING OF CONTACT LAYERS ON CERAMIC COMPONENTS

Title (en)

METHOD FOR ELECTROPLATING OF CONTACT LAYERS ON CERAMIC COMPONENTS

Title (de)

VERFAHREN ZUM GALVANISCHEN AUFBRINGEN VON KONTAKTSCHICHTEN AUF KERAMISCHE BAUELEMENTE

Title (fr)

PROCEDE DE DEPOT PAR GALVANISATION DE COUCHES DE CONTACT SUR DES COMPOSANTS EN CERAMIQUE

Publication

EP 1530654 A2 20050518 (DE)

Application

EP 02754511 A 20020808

Priority

DE 0202931 W 20020808
DE 10147897 A 20010928

Abstract (en)

[origin: DE10147897C1] Process for directly galvanizing contact layers onto ceramic components comprises initially activating the regions (3) of the components (1) to be galvanized using chemical and mechanical treatment in an aqueous solution containing phosphoric acid and having a pH of 1.0-1.5; and applying the contact layers directly on the treated components using a galvanic process. Preferred Features: A high ohmic passivating layer is used in the first step, preferably a spinel of formula Ab2O4 or perovskite of formula: MIIxMIII1-xTiIVx+yCoIII1-y2yO3 (where MII = Sr or Ba; MIII = rare earth; x = 0-0.85; y = 0-(1-x)/2; and x+y is not more than 1), or a ceramic of the formula: (Pb, La)(Zr, Ti)O3.

IPC 1-7

C25D 5/54

IPC 8 full level

C04B 35/465 (2006.01); C04B 35/49 (2006.01); C04B 41/45 (2006.01); C04B 41/81 (2006.01)

CPC (source: EP)

C04B 35/01 (2013.01); C04B 35/465 (2013.01); C04B 35/49 (2013.01); C04B 41/009 (2013.01); C04B 41/4564 (2013.01); C04B 41/81 (2013.01); C04B 2111/00844 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3275 (2013.01)

C-Set (source: EP)

C04B 41/4564 + C04B 41/4572 + C04B 41/5161 + C04B 41/53
C04B 41/009 + C04B 35/00

Citation (search report)

See references of WO 03031671A2

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

DE 10147897 C1 20030123; EP 1530654 A2 20050518; TW 572869 B 20040121; WO 03031671 A2 20030417; WO 03031671 A3 20050324

DOCDB simple family (application)

DE 10147897 A 20010928; DE 0202931 W 20020808; EP 02754511 A 20020808; TW 91118564 A 20020816