EP 1531267 A3 20060517 - Pumping device using thermal-transpiration micropumps
Title (en)
Pumping device using thermal-transpiration micropumps
Title (de)
Pumpvorrichtung mit Mikropumpen, die einen thermischen Transpirationseffekt nutzen
Title (fr)
Dispositif de pompage par micropompes à transpiration thermique
Publication
Application
Priority
FR 0312894 A 20031104
Abstract (en)
[origin: EP1531267A2] The device has heat transpiration micropumps (1, 6-9) placed on a semiconductor substrate (5) in several rows (A-D) and columns (a-d). Each micropump has a channel (3) and a heating unit (4) connected in series with a transistor whose base is connected to an output of an AND gate whose respective inputs are connected to a row control conductor and a column control conductor.
IPC 8 full level
B81B 1/00 (2006.01); F04B 37/06 (2006.01); B81B 7/02 (2006.01); F04B 19/00 (2006.01); F04B 19/24 (2006.01); F04B 43/04 (2006.01); F04B 49/06 (2006.01)
CPC (source: EP US)
F04B 19/006 (2013.01 - EP US); F04B 19/24 (2013.01 - EP US)
Citation (search report)
- [A] US 6533554 B1 20030318 - VARGO STEPHEN E [US], et al
- [A] US 6422823 B2 20020723 - BERNARD ROLAND [FR], et al
- [A] US 5871336 A 19990216 - YOUNG ROBERT M [US]
- [A] US 2002076140 A1 20020620 - KOBRIN BORIS [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LU MC NL PL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1531267 A2 20050518; EP 1531267 A3 20060517; EP 1531267 B1 20081203; AT E416311 T1 20081215; DE 602004018089 D1 20090115; FR 2861814 A1 20050506; FR 2861814 B1 20060203; JP 2005163784 A 20050623; US 2005095143 A1 20050505; US 7572110 B2 20090811
DOCDB simple family (application)
EP 04292591 A 20041102; AT 04292591 T 20041102; DE 602004018089 T 20041102; FR 0312894 A 20031104; JP 2004313419 A 20041028; US 97914904 A 20041103