Global Patent Index - EP 1532193 A2

EP 1532193 A2 20050525 - ORGANOSILOXANES

Title (en)

ORGANOSILOXANES

Title (de)

ORGANOSILOXANE

Title (fr)

ORGANOSILOXANES

Publication

EP 1532193 A2 20050525 (EN)

Application

EP 03796272 A 20030603

Priority

  • US 0317658 W 20030603
  • US 16156102 A 20020603

Abstract (en)

[origin: WO2004037877A2] The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z 0.01-1.0SiO1.5-2 ]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I.The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.

IPC 1-7

C08G 77/12; C08G 77/20; B05D 3/02; B05D 3/06; C23C 16/00; H01L 21/31

IPC 8 full level

C08G 77/12 (2006.01); C09D 183/04 (2006.01); G03F 7/075 (2006.01); H01L 21/312 (2006.01); H01L 21/768 (2006.01)

CPC (source: EP KR)

C08G 77/12 (2013.01 - EP); C08L 83/04 (2013.01 - KR); C09D 183/04 (2013.01 - EP); G03F 7/0751 (2013.01 - EP); H01L 21/02126 (2013.01 - EP); H01L 21/02211 (2013.01 - EP); H01L 21/02282 (2013.01 - EP); H01L 21/76829 (2013.01 - EP); H01L 21/76807 (2013.01 - EP); H01L 2924/12044 (2013.01 - EP)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

WO 2004037877 A2 20040506; WO 2004037877 A3 20050113; WO 2004037877 A9 20041111; AU 2003298518 A1 20040513; AU 2003298518 A8 20040513; CN 1671772 A 20050921; EP 1532193 A2 20050525; EP 1532193 A4 20051026; JP 2006503165 A 20060126; KR 20050016505 A 20050221; TW 200307709 A 20031216

DOCDB simple family (application)

US 0317658 W 20030603; AU 2003298518 A 20030603; CN 03818530 A 20030603; EP 03796272 A 20030603; JP 2004546678 A 20030603; KR 20047019702 A 20041203; TW 92103913 A 20030225