EP 1532681 A1 20050525 - MULTI-LAYER CIRCUIT CARRIER AND PRODUCTION THEREOF
Title (en)
MULTI-LAYER CIRCUIT CARRIER AND PRODUCTION THEREOF
Title (de)
MEHRLAGIGER SCHALTUNGSTRÄGER UND HERSTELLUNG DESSELBEN
Title (fr)
SUPPORT DE CIRCUIT A PLUSIEURS COUCHES ET FABRICATION DUDIT SUPPORT
Publication
Application
Priority
- DE 0302575 W 20030731
- DE 10235332 A 20020801
Abstract (en)
[origin: DE10235332A1] Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. An anchoring layer (12) is arranged between the rewiring layer and the insulating layer and contains metallic plates (13) for fixing the through-structures in the switch support. The outer contact surfaces and the metallic plates are electrically connected to the rewiring structure. Independent claims are also included for processes for the production of the switch support.
IPC 1-7
IPC 8 full level
H01L 21/48 (2006.01); H01L 23/055 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2006.01); H05K 3/20 (2006.01)
CPC (source: EP US)
H01L 21/4857 (2013.01 - EP US); H01L 21/486 (2013.01 - EP US); H01L 23/055 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 23/49805 (2013.01 - EP US); H01L 23/49811 (2013.01 - EP US); H01L 23/49822 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H01L 23/49833 (2013.01 - EP US); H01L 23/49861 (2013.01 - EP US); H01L 23/5389 (2013.01 - EP US); H05K 1/113 (2013.01 - EP US); H05K 3/4647 (2013.01 - EP US); H05K 3/4682 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 27/14618 (2013.01 - EP US); H01L 31/0203 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/32013 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/12041 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15174 (2013.01 - EP US); H01L 2924/15184 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/15313 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H05K 3/205 (2013.01 - EP US); H05K 2201/2072 (2013.01 - EP US); H05K 2203/0733 (2013.01 - EP US)
Citation (search report)
See references of WO 2004015770A1
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
DE 10235332 A1 20040219; EP 1532681 A1 20050525; US 2005151246 A1 20050714; US 7221048 B2 20070522; WO 2004015770 A1 20040219
DOCDB simple family (application)
DE 10235332 A 20020801; DE 0302575 W 20030731; EP 03783945 A 20030731; US 4689205 A 20050201