EP 1533526 A1 20050525 - VACUUM PUMP
Title (en)
VACUUM PUMP
Title (de)
VAKUUMPUMPE
Title (fr)
POMPE A VIDE
Publication
Application
Priority
- JP 0306260 W 20030520
- JP 2002145320 A 20020520
Abstract (en)
The invention relates to a heat insulation structure having the function of retaining a high temperature in a vacuum exhaust chamber in a rotary type vacuum pump and the function of cooling bearings at the same time, and particularly has for its object the provision of a structure for preventing bearings or shaft seals from becoming so high in temperature as to be damaged when a high temperature is to be retained in an exhaust chamber with respect to a vacuum pump for exhausting reactive gases as in a semiconductor process. As a means to achieve the object, in a vacuum pump comprising an introduction means having a vacuum exhaust chamber and adapted to introduce a process gas into the vacuum exhaust chamber, an exhaust means for exhausting the process gas out of the vacuum exhaust chamber, a housing for separating the vacuum exhaust chamber from outside, with a rotor installed fro rotation in the housing through a bearing, a heat insulation means is provided between the vacuum exhaust chamber and the bearing. Further, a metal whose thermal conductivity is higher than that of the material of the housing is incorporated as a heat transmission means into the housing. <IMAGE>
IPC 1-7
IPC 8 full level
F04C 29/04 (2006.01); F04C 18/16 (2006.01)
CPC (source: EP US)
F04C 29/04 (2013.01 - EP US); F04C 18/16 (2013.01 - EP US); F04C 2240/10 (2013.01 - EP US); F05C 2225/04 (2013.01 - EP US); F05C 2251/048 (2013.01 - EP US)
Citation (search report)
See references of WO 03098047A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1533526 A1 20050525; AU 2003234835 A1 20031202; CN 1656316 A 20050817; JP WO2003098047 A1 20050915; TW 200403392 A 20040301; TW I277696 B 20070401; US 2005254969 A1 20051117; WO 03098047 A1 20031127
DOCDB simple family (application)
EP 03728116 A 20030520; AU 2003234835 A 20030520; CN 03811707 A 20030520; JP 0306260 W 20030520; JP 2004505543 A 20030520; TW 92113601 A 20030520; US 51522105 A 20050605