EP 1537186 A1 20050608 - SOLVENT-FREE HOT MELT ADHESIVE, ITS USE IN BONDING A POLAR LEATHER LAYER TO A NON-POLAR SUBSTRATE, AND LEATHER ARTICLES SO PRODUCED
Title (en)
SOLVENT-FREE HOT MELT ADHESIVE, ITS USE IN BONDING A POLAR LEATHER LAYER TO A NON-POLAR SUBSTRATE, AND LEATHER ARTICLES SO PRODUCED
Title (de)
LöSUNGSMITTELFREIER SCHMELZKLEBSTOFF, DESSEN VERWENDUNG ZUR VERKLEBUNG EINER POLAREN LEDERSCHICHT AUF EINEM NICHTPOLAREN SUBSTRAT SOWIE SO HERGESTELLTE LEDERARTIKEL
Title (fr)
ADHESIF THERMOFUSIBLE SANS SOLVANT, SON UTILISATION POUR FIXER UNE COUCHE DE CUIR POLAIRE SUR UN SUBSTRAT NON POLAIRE, ET ARTICLES EN CUIR PRODUITS AU MOYEN DUDIT ADHESIF
Publication
Application
Priority
- EP 03766313 A 20030723
- EP 0308261 W 20030723
- EP 02016728 A 20020726
Abstract (en)
[origin: EP1384768A1] A solvent free, hot melt adhesive composition to be used for bonding a polar leather layer to a non-polar substrate, comprising: (a) a block copolymer, comprising at least one acid functionalized, selectively hydrogenated inner block predominantly derived from a conjugated diene which block has been functionalized by acid grafting, and at least two terminal blocks, predominantly derived from a vinylarene; (b) a hydrogenated hydrocarbon tackifying resin, with a softening point lower than 140 DEG C. in a weight proportion of 30 to 150 PHR (parts by weight of tackifying resin per 100 parts per weight of block copolymer); (c) a resin which is compatible with the predominantly poly(vinylarene) blocks, having a softening point lower than 140 DEG C in a weight proportion of from 10 to 80 PHR; (d) optionally a melt flow improving poly(alkylene) resin, which has been functionalized, in a weight proportion of from 0 to 30 parts PHR, and (e) stabilizers and/or additional auxiliaries in a weight proportion of from 0.1 to 1 PHR, as well as its use for bonding a polar leather layer to a non-polar substrate and formed leather articles composed by means of said adhesive composition.
IPC 1-7
IPC 8 full level
C08L 51/00 (2006.01); C08L 53/02 (2006.01); C09J 151/00 (2006.01); C09J 153/02 (2006.01)
CPC (source: EP)
C08L 51/006 (2013.01); C08L 53/025 (2013.01); C09J 151/006 (2013.01); C09J 153/025 (2013.01); C08L 2666/04 (2013.01)
Citation (search report)
See references of WO 2004013247A1
Designated contracting state (EPC)
IT
DOCDB simple family (publication)
EP 1384768 A1 20040128; AU 2003253333 A1 20040223; CN 1290957 C 20061220; CN 1678707 A 20051005; EP 1537186 A1 20050608; TW 200415221 A 20040816; TW I248461 B 20060201; WO 2004013247 A1 20040212
DOCDB simple family (application)
EP 02016728 A 20020726; AU 2003253333 A 20030723; CN 03820096 A 20030723; EP 0308261 W 20030723; EP 03766313 A 20030723; TW 92120516 A 20030728